Machine Introduction
The Double-sided Automated Optical Inspection System AOI VS5300 Series is a high-performance automatic optical inspection solution designed for simultaneous top-and-bottom PCBA inspection. With advanced big-data algorithms, AI deep learning, and proprietary positioning technology, the VS5300 delivers fast, accurate, and fully unmanned inspection for SMT, wave soldering, and final quality control. Its unique dual-side inspection capability reduces production space, improves efficiency, and ensures precise detection of complex solder joints, through-hole components, and micro defects across the entire board. Ideal for modern electronics manufacturing, the VS5300 helps factories achieve higher yield, lower false calls, and stable long-term quality traceability.
Key Features
● Simultaneous Double-sided PCBA Inspection
Inspect top and bottom surfaces in one pass, reducing production footprint and lowering automation investment.
● AI-powered Defect Identification
Big data + AI deep learning enhances detection accuracy for components and solder joints, reducing manual judgment and false calls.
● Automatic Pin Programming
One-click pin learning enables rapid program setup, improving inspection efficiency for diverse PCB layouts.
● Intelligent Solder Pad Positioning & Full FOV Alignment
Proprietary algorithms minimize false calls caused by PCB deformation, warpage, silkscreen deviation, and board legends-especially effective for FPC.
● Wave Soldering Through-Hole Inspection
Advanced algorithm detects missing pins, blowholes, insufficient solder, solder balls, and other THT defects with high precision.
● High Compatibility with SMT & Wave Soldering Lines
Supports printers, SPI, mounters, pre-reflow AOI, wave soldering lines, and final inspection stations.
● Comprehensive SPC & Traceability Functions
Built-in SPC alarm, double-side barcode binding, and output of complete board images to ensure strong traceability and stable quality control.
● Fully Automated Workflow with MES Support
Auto program switching via barcode scanning and complete integration with MES for smart manufacturing.
Multifunctionality
Inspection Examples
Automatic Pin Programming
Our Automatic Pin Programming uses big data and AI deep learning to instantly recognize component pins with one click. This intelligent algorithm greatly shortens programming time, improves accuracy, and enhances AOI efficiency for high-mix PCBAs. Ideal for fast setup and stable inspection in modern SMT production.
Our AI Intelligent Discrimination system uses advanced big-data analytics and deep-learning algorithms to automatically detect defects, reduce false calls, and minimize manual inspection workload. It significantly improves AOI performance and enhances production efficiency.
Key Features
• AI deep-learning defect recognition
• Automatic error identification with reduced manual review
• Continuous PPM reduction shown through AOI + AI optimization
• Stable performance for high-volume SMT production lines
Our intelligent solder pad and full-FOV positioning technology greatly reduces false calls caused by PCB deformation, warpage, and silkscreen interference, ensuring more accurate inspection.
Our powerful wave-solder inspection algorithm accurately detects good solder, insufficient solder, missing pins, and blowholes for reliable through-hole quality control.
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Category |
Item |
VS300 |
VS300XL |
|
Image System |
Camera |
5MP / 12MP industrial camera |
5MP / 12MP industrial camera |
|
Resolution |
5MP Camera: 24μm, 15μm; 12MP Camera: 15μm |
5MP Camera: 24μm, 15μm; 12MP Camera: 15μm |
|
|
FOV |
6049mm (5MP, 24μm); 6045mm (12MP, 15μm) |
6049mm (5MP, 24μm); 6045mm (12MP, 15μm) |
|
|
Lens |
Telecentric lens |
Telecentric lens |
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Lighting |
4 color ring shape LED (RGBW) |
4 color ring shape LED (RGBW) |
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Movement Structure |
X/Y Movement |
AC Servo |
AC Servo (Dual Drive) |
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Width Adjustment |
Automatic |
Automatic |
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Transport Type |
Belt (Roller pulley optional) |
Belt (Roller pulley optional) |
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|
Board Loading Direction |
Left to right or right to left (Select at order) |
Left to right or right to left (Select at order) |
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Fixed Rail |
1st Rail |
1st Rail |
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Operating System |
Win 10 |
Win 10 |
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Communication |
Ethernet, SMEMA |
Ethernet, SMEMA |
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Power Requirement |
Single phase 220V, 50/60Hz, 5A |
Single phase 220V, 50/60Hz, 5A |
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|
Air Requirement |
0.4–0.6MPa |
0.4–0.6MPa |
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Conveyor Height |
900±20mm (740±20mm optional) |
900±20mm (740±20mm optional) |
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Equipment Weight |
900kg |
1000kg |
|
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Equipment Dimensions |
L1045D1470H1600mm (without tower light) |
L1200D1470H1600mm (without tower light) |
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Size |
5050–510510mm |
5050–650610mm |
|
|
PCB Size |
PCB Weight |
≤10kg (Roller pulley optional: ≤30kg) |
≤10kg (Roller pulley optional: ≤30kg) |
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Thermotolerance |
≤60°C (Roller pulley optional: ≤150°C) |
≤60°C (Roller pulley optional: ≤150°C) |
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Thickness |
0.6–6mm (Roller pulley optional: ≤6.0mm) |
0.6–6mm (Roller pulley optional: ≤6.0mm) |
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Component Clearance |
Top: 25–85mm; Bottom: 25–80mm |
Top: 25–85mm; Bottom: 25–80mm |
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Clamping Edge |
3.0mm |
3.0mm |
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Inspection Criteria |
Component |
Wrong Component, Missing, Polarity, Misalignment, Reverse, IC Lead Bend, Foreign Material, Tombstone, etc. |
Same as VS300 |
|
Solder Joint |
No Solder, Insufficient Solder, Open Solder, Excess Solder, Solder Bridge, Blowhole, Solder Ball, etc. |
Same as VS300 |
|
|
Inspection Component |
Chip: 03015 and above; LSI: 0.3mm pitch and above; Others: Odd shape components |
Same as VS300 |
|
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Inspection Speed |
200–250ms/FOV |
200–250ms/FOV |
Product data is for reference only. Please contact us to confirm the latest information.
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