Machine Introduction
The VS5300 Double-sided 3D Automated Optical Inspection System AOI is a high-performance inspection system designed for simultaneous top and bottom PCBA inspection. With AI algorithms, advanced solder pad positioning, and high-speed FOV scanning, it provides accurate defect detection for SMT, wave soldering, and final inspection applications. It improves production efficiency, reduces false calls, and supports full-line automation for modern electronics manufacturing.
Key Features
- Double-sided inspection for top & bottom PCBA in one pass, reducing space and investment.
- AI intelligent discrimination to identify defects automatically and minimize manual checks.
- Automatic pin programming with big data + deep learning for fast setup.
- Solder Pad + FOV Assisted Positioning reduces false calls caused by warpage or deformation.
- Strong through-hole soldering algorithm for blowhole, missing pin, and insufficient solder detection.
- Supports full SMT & wave soldering lines, including pre-reflow and final inspection.
- Barcode-based program switching for fast line changeover and MES integration.
- High traceability with full board photo output and centralized management system.
Multifunctionality
Examples Inspection
Automatic Pin Programming
Our Automatic Pin Programming uses big data and AI deep learning to recognize component pins with one click. This smart algorithm greatly reduces programming time, improves accuracy, and accelerates AOI setup for high-efficiency SMT production. Perfect for fast line changeovers and optimized PCBA inspection.
AI Intelligent Discrimination
Our AI Intelligent Discrimination uses big data and deep learning to automatically detect defects, reduce false calls, and minimize manual intervention. This advanced AI engine improves inspection accuracy and helps stabilize quality across high-volume SMT production.
Intelligent Solder Pad Positioning
Our intelligent solder pad positioning and full-FOV assisted algorithm greatly reduce false calls caused by PCB deformation, warpage, silkscreen interference and post-wave-soldering shift. This advanced positioning technology ensures higher inspection accuracy for both PCB and FPC applications.
Powerful Wave Soldering Algorithm
Our advanced wave soldering algorithm ensures accurate inspection of through-hole components, whether manually or machine inserted. It reliably detects good solder, insufficient solder, missing pins, and blowholes, improving THT solder quality and reducing defects.
Product Specifications
|
Category |
Item |
Specification |
|
Equipment Model |
Model |
VS7300 |
|
Image System |
Camera |
12MP/21MP industrial camera |
|
|
Resolution |
12MP: 15µm; 21MP: 10µm |
|
|
FOV |
60*45mm (12MP, 15µm); 50*40mm (21MP, 10µm) |
|
|
Lighting |
4 color programmable ring shape LED (RGBW) |
|
|
Height Measurement Method |
Structured grating*4 on each sided |
|
Movement Structure |
X/Y Movement |
Dual AC Servo Drive |
|
|
Width Adjustment |
Automatic |
|
|
Transport Type |
Belt |
|
|
Board Loading Direction |
Left to right / right to left (Select at order) |
|
|
Fixed Trail |
Front trail |
|
Hardware Configuration |
Operating System |
Win 10 |
|
|
Communication |
Ethernet, SMEMA |
|
|
Power Requirement |
Single phase 220V, 50/60Hz, 8A, 1.8kW |
|
|
Air Requirement |
0.4–0.6MPa |
|
|
Conveyor Height |
900±20mm |
|
|
Equipment Dimensions |
L1200mm * D1620mm * H1610mm (Without tower light) |
|
|
Equipment Weight |
1250kg |
|
PCB Size |
Size |
50*50–510*510mm (Up to 820*510mm in multiple sections) |
|
|
Thickness |
≤6.0mm |
|
|
Warping |
±3.0mm |
|
|
Component Clearance |
Top: 30–65mm adjustable; Bottom: 30–50mm adjustable |
|
|
Clamping Edge |
3.0mm |
|
|
PCB Weight |
≤8.0kg |
|
Inspection Categories |
Component |
Wrong part, missing, polarity, offset, flip, damage, IC pin bending, IC lifting, foreign object, tombstone, etc. |
|
|
Solder Paste |
Missing pin, solder hole, no solder, insufficient/excess solder, no protrusion lead, bridge, open soldering, etc. |
|
Inspection Capabilities |
Inspection Component |
Chip: 03015 and above (3D); LSI: 0.3mm pitch and above; Others: Odd shape components |
|
|
Max Height Range |
35mm (15µm resolution) |
|
|
Inspection Speed |
450–550ms/FOV |
Product data is for reference only. Please contact us to confirm the latest information.
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