Machine Introduction
The Inverted Camera Automated Optical Inspection System AOI-V5200 Series is designed for high-accuracy post-reflow and wave soldering inspection without flipping the PCB. Installed at the bottom side of the production line, this AOI delivers fast, stable, and repeatable detection of solder joints, THT components, and odd-form parts. With advanced deep-learning algorithms, automatic pin programming, and precise three-level positioning technology, the V5200 ensures reliable inspection results even under high-temperature, high-load production environments. It is ideal for SMT, DIP, and wave soldering lines requiring superior inspection efficiency and reduced manual intervention.
Key Features
- Bottom-side inspection-no need to flip PCB, improving efficiency.
- Optimized algorithm for post-wave and THT solder inspection.
- One-click automatic pin programming with AI identification.
- AI defect discrimination reduces manual checking.
- Three-level positioning for high accuracy and stable detection.
- IPC-aligned inspection parameters for reliable results.
- Detects major defects: missing pin, blowhole, solder bridge, open/insufficient solder, excess glue, etc.
- Fiber sensor drop-board alarm for safety.
- Heat-resistant conveyor for stable inline operation.
- Supports MES, barcode program switching, and centralized AOI management.
Production Line Solution
Inspection Examples
Automatic Pin Programming
The Automatic Pin Programming system uses big data and AI deep-learning algorithms to recognize components with a single click. This smart automation greatly reduces manual setup time, improves programming accuracy, and accelerates AOI production-line deployment.
AI Intelligent Discrimination
Our AI intelligent discrimination system uses big data and deep-learning algorithms to automatically identify defects, lower PPM rates, and reduce manual handling, ensuring faster and more accurate AOI inspection.
Three-level Positioning Technology
Our three-level positioning technology-PCB, FOV, and solder-pad positioning-effectively reduces false calls caused by board deformation. It enhances detection accuracy and improves the reliability of thru-hole defect inspection.
Detection Parameters Aligned to IPC Standards
Our inspection algorithm follows IPC standards to calculate accurate offsets, ensuring more reliable and consistent results. By aligning with IPC-A-610-G Class 3 criteria, the system improves judgment accuracy for component overhang, pad alignment, and shift rate.
Powerful Wave Soldering Algorithm
Our advanced wave soldering algorithm ensures accurate inspection of through-hole components, detecting defects such as insufficient solder, missing pins, and blowholes with high reliability-whether manually or machine inserted.
|
Specification |
V5200 |
V5200XL |
|
Camera |
5MP/12MP industrial camera |
5MP/12MP industrial camera |
|
Resolution |
5MP: 24μm, 15μm; 12MP: 15μm |
5MP: 24μm, 15μm; 12MP: 15μm |
|
FOV |
60*49mm (5MP, 24μm); 60*45mm (12MP, 15μm) |
Same |
|
Lens |
Telecentric lens |
Telecentric lens |
|
Lighting |
4 color ring shape LED (RGBW) |
4 color ring shape LED (RGBW) |
|
X/Y Movement |
AC Servo |
AC Servo (Dual Drive) |
|
Width Adjustment |
Automatic |
Automatic |
|
Transport Type |
Roller Pulley |
Roller Pulley |
|
Board Loading Direction |
Left→Right or Right→Left |
Left→Right or Right→Left |
|
Fixed Rail |
1st Rail |
1st Rail |
|
Operating System |
Win 10 |
Win 10 |
|
Communication |
Ethernet, SMEMA |
Ethernet, SMEMA |
|
Power Requirement |
Single phase 220V, 50/60Hz, 5A |
Single phase 220V, 50/60Hz, 5A |
|
Air Requirement |
0.4–0.6MPa |
0.4–0.6MPa |
|
Conveyor Height |
900±20mm (740±20mm optional) |
900±20mm (740±20mm optional) |
|
Equipment Dimensions |
L1045*D1470*H1600mm |
L1200*D1470*H1600mm |
|
Equipment Weight |
700kg |
850kg |
|
PCB Size |
50*50–510*510mm |
50*50–650*610mm |
|
PCB Weight |
≤3.0kg |
≤3.0kg |
|
Component Clearance |
Top 120mm; Bottom 25–50mm adjustable |
Same |
|
Clamping Edge |
3.0mm |
3.0mm |
|
Inspection – Component |
Wrong, Missing, Polarity, Misalignment, Reverse, IC Lead Bend, Foreign Material, Tombstone |
Same |
|
Inspection – Solder Joint |
No Solder, Insufficient, Open, Excess, Bridge, Blowhole, Ball |
Same |
|
Inspection Speed |
180–200ms/FOV |
180–200ms/FOV |
Product data is for reference only. Please contact us to confirm the latest information.
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