Machine Introduction
The VS5100 Top-sided AOI Wave Soldering AOI is designed for high-precision inspection before and after wave soldering. It features intelligent programming, powerful algorithms, and stable detection performance, making it ideal for PCBA quality control. With high detection accuracy, low false calls, and strong adaptability to various board types, it ensures reliable inspection for intelligent manufacturing.
Key Features
- Intelligent AI programming for fast component and solder joint setup.
- Advanced algorithms supporting SMT, wave soldering, and special-shaped components.
- High detection accuracy with three-level positioning to reduce false calls.
- Supports large, heavy, and special PCBA boards with stable belt/roller transport.
- Suitable for both pre-furnace and post-furnace inspection applications.
- Anti-seismic and anti-shake design ensures long-term stable operation.
Production Line Solution

Example Inspection

Our Intelligent Programming uses big data and AI deep learning to auto-identify components and solder joints with one click. It greatly reduces setup time, improves accuracy, and ensures fast, reliable inspection for both pre-furnace and post-furnace processes.

Our three-level positioning technology-PCB positioning, FOV positioning, and solder pad positioning-effectively reduces false positives and false negatives caused by PCB warpage. It enhances detection accuracy, stability, and overall inspection performance.

Our DIP intelligent special algorithm accurately identifies component polarity before the furnace and detects solder defects after the furnace. It streamlines the inspection process, improves detection accuracy, and reduces training difficulty and overall operating cost.

Our server-specific algorithm is designed to accurately detect various connectors on servers and PC motherboards, including high-density interfaces and DIMMs. It enhances inspection reliability and ensures stable quality control for complex board assemblies.

Product Specification
|
Category |
Item |
V5100 |
V5100XL |
|
Image System |
Camera |
5MP / 12MP industrial camera |
5MP / 12MP industrial camera |
|
Resolution |
5MP Camera: 24μm, 15μm; 12MP Camera: 15μm |
5MP Camera: 24μm, 15μm; 12MP Camera: 15μm |
|
|
FOV |
60×49mm (5MP, 24μm); 60×45mm (12MP, 15μm) |
60×49mm (5MP, 24μm); 60×45mm (12MP, 15μm) |
|
|
Lens |
Telecentric Lens |
Telecentric Lens |
|
|
Lighting |
4 color ring shape LED (RGBW) |
4 color ring shape LED (RGBW) |
|
|
Movement Structure |
X/Y Movement |
AC Servo |
AC Servo (Dual Drive) |
|
Width Adjustment |
Automatic |
Automatic |
|
|
Transport Type |
Belt (Roller pulley optional) |
Belt (Roller pulley optional) |
|
|
Board Loading Direction |
Left to right or right to left (select at order) |
Left to right or right to left (select at order) |
|
|
Fixed Rail |
1st Rail |
1st Rail |
|
|
Hardware Configuration |
Operating System |
Win 10 |
Win 10 |
|
Communication |
Ethernet, SMEMA |
Ethernet, SMEMA |
|
|
Power Requirement |
Single phase 220V, 50/60Hz, 5A |
Single phase 220V, 50/60Hz, 5A |
|
|
Air Requirement |
0.4–0.6MPa |
0.4–0.6MPa |
|
|
Conveyor Height |
900±20mm (740±20mm optional) |
900±20mm (740±20mm optional) |
|
|
Equipment Weight |
700kg |
850kg |
|
|
Equipment Dimensions |
L1045×D1470×H1600mm (without tower light) |
L1200×D1470×H1600mm (without tower light) |
|
|
PCB Size |
Size |
50×50–510×510mm |
50×50–650×610mm |
|
PCB Weight |
≤8kg (Roller pulley optional: ≤20kg) |
≤8kg (Roller pulley optional: ≤20kg) |
|
|
Thermotolerance |
≤60°C (Roller pulley optional: ≤150°C) |
≤60°C (Roller pulley optional: ≤150°C) |
|
|
Thickness |
≤6.0mm |
≤6.0mm |
|
|
Component Clearance |
Top: 25–85mm adjustable; Bottom: 25–80mm adjustable |
Top: 25–85mm adjustable; Bottom: 25–80mm adjustable |
|
|
Clamping Edge |
3.0mm |
3.0mm |
|
|
Inspection Criteria |
Component |
Wrong Component, Missing, Polarity, Misalignment, Reverse, IC Lead Bend, Foreign Material, Tombstone, etc. |
Same |
|
Solder Joint |
No Solder, Insufficient Solder, Open Solder, Excess Solder, Solder Bridge, Blowhole, Solder Ball, etc. |
Same |
|
|
Inspection Component |
Chip: 03015 and above; LSI: 0.3mm pitch and above; Others: Odd shape component |
Same |
|
|
Inspection Speed |
180–200ms / FOV |
180–200ms / FOV |
Product data is for reference only. Please contact us to confirm the latest information.
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