Products
Top-side AOI

Top-side AOI

The VS5100 Top-sided AOI Wave Soldering AOI is designed for high-precision inspection before and after wave soldering. It features intelligent programming, powerful algorithms, and stable detection performance, making it ideal for PCBA quality control. With high detection accuracy, low false calls, and strong adaptability to various board types, it ensures reliable inspection for intelligent manufacturing.

Machine Introduction

 

The VS5100 Top-sided AOI Wave Soldering AOI is designed for high-precision inspection before and after wave soldering. It features intelligent programming, powerful algorithms, and stable detection performance, making it ideal for PCBA quality control. With high detection accuracy, low false calls, and strong adaptability to various board types, it ensures reliable inspection for intelligent manufacturing.

 

Key Features

 

  • Intelligent AI programming for fast component and solder joint setup.
  • Advanced algorithms supporting SMT, wave soldering, and special-shaped components.
  • High detection accuracy with three-level positioning to reduce false calls.
  • Supports large, heavy, and special PCBA boards with stable belt/roller transport.
  • Suitable for both pre-furnace and post-furnace inspection applications.
  • Anti-seismic and anti-shake design ensures long-term stable operation.

 

Production Line Solution

 

Inverted Camera AOI for Offset and Skew Detection

 

Example Inspection

 

 

Inverted Camera AOI for Solder Joint Visual Inspection

Our Intelligent Programming uses big data and AI deep learning to auto-identify components and solder joints with one click. It greatly reduces setup time, improves accuracy, and ensures fast, reliable inspection for both pre-furnace and post-furnace processes.

Inverted Camera AOI for Component Presence

Our three-level positioning technology-PCB positioning, FOV positioning, and solder pad positioning-effectively reduces false positives and false negatives caused by PCB warpage. It enhances detection accuracy, stability, and overall inspection performance.

Inverted Camera AOI for Polarity Inspection

Our DIP intelligent special algorithm accurately identifies component polarity before the furnace and detects solder defects after the furnace. It streamlines the inspection process, improves detection accuracy, and reduces training difficulty and overall operating cost.

Inverted Camera AOI for High-Mix SMT Lines

Our server-specific algorithm is designed to accurately detect various connectors on servers and PC motherboards, including high-density interfaces and DIMMs. It enhances inspection reliability and ensures stable quality control for complex board assemblies.

Inverted Camera AOI to Reduce Handling Errors

 

Product Specification

 

Category

Item

V5100

V5100XL

Image System

Camera

5MP / 12MP industrial camera

5MP / 12MP industrial camera

 

Resolution

5MP Camera: 24μm, 15μm; 12MP Camera: 15μm

5MP Camera: 24μm, 15μm; 12MP Camera: 15μm

 

FOV

60×49mm (5MP, 24μm); 60×45mm (12MP, 15μm)

60×49mm (5MP, 24μm); 60×45mm (12MP, 15μm)

 

Lens

Telecentric Lens

Telecentric Lens

 

Lighting

4 color ring shape LED (RGBW)

4 color ring shape LED (RGBW)

Movement Structure

X/Y Movement

AC Servo

AC Servo (Dual Drive)

 

Width Adjustment

Automatic

Automatic

 

Transport Type

Belt (Roller pulley optional)

Belt (Roller pulley optional)

 

Board Loading Direction

Left to right or right to left (select at order)

Left to right or right to left (select at order)

 

Fixed Rail

1st Rail

1st Rail

Hardware Configuration

Operating System

Win 10

Win 10

 

Communication

Ethernet, SMEMA

Ethernet, SMEMA

 

Power Requirement

Single phase 220V, 50/60Hz, 5A

Single phase 220V, 50/60Hz, 5A

 

Air Requirement

0.4–0.6MPa

0.4–0.6MPa

 

Conveyor Height

900±20mm (740±20mm optional)

900±20mm (740±20mm optional)

 

Equipment Weight

700kg

850kg

 

Equipment Dimensions

L1045×D1470×H1600mm (without tower light)

L1200×D1470×H1600mm (without tower light)

PCB Size

Size

50×50–510×510mm

50×50–650×610mm

 

PCB Weight

≤8kg (Roller pulley optional: ≤20kg)

≤8kg (Roller pulley optional: ≤20kg)

 

Thermotolerance

≤60°C (Roller pulley optional: ≤150°C)

≤60°C (Roller pulley optional: ≤150°C)

 

Thickness

≤6.0mm

≤6.0mm

 

Component Clearance

Top: 25–85mm adjustable; Bottom: 25–80mm adjustable

Top: 25–85mm adjustable; Bottom: 25–80mm adjustable

 

Clamping Edge

3.0mm

3.0mm

Inspection Criteria

Component

Wrong Component, Missing, Polarity, Misalignment, Reverse, IC Lead Bend, Foreign Material, Tombstone, etc.

Same

 

Solder Joint

No Solder, Insufficient Solder, Open Solder, Excess Solder, Solder Bridge, Blowhole, Solder Ball, etc.

Same

 

Inspection Component

Chip: 03015 and above; LSI: 0.3mm pitch and above; Others: Odd shape component

Same

 

Inspection Speed

180–200ms / FOV

180–200ms / FOV

 

Product data is for reference only. Please contact us to confirm the latest information.

 

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