Machine Introduction
The Cube Series 3D AOI is a high-performance 3D automated optical inspection system designed for SMT pre-reflow and post-reflow quality control. Using advanced 3D fringe projection, AI algorithms, and multi-angle imaging, it delivers accurate height measurement, reliable defect detection, and stable inspection results for high-density PCBs. Its intelligent positioning, zero-reference technology, and wide measurement range make it ideal for modern electronics manufacturing lines seeking fast, precise, and consistent inspection performance.
Key Features
- High-accuracy 3D inspection with advanced multi-fringe projection technology.
- AI-powered defect detection for solder, components, and coplanarity issues.
- Zero-reference measurement ensures stable results regardless of PCB color or surface changes.
- Wide height measurement range up to 35mm for tall components.
- Adaptive positioning technology efficiently handles different PCB types.
- Fast and easy programming with intelligent software and SPC data analysis.
- Barcode-based program switching supporting MES integration.
- Real-time monitoring & SPC alarms for quality control and yield improvement.
Production Line Solution
The 3D AOI system uses advanced phase-shift fringe projection to accurately capture the true 3D profile of solder paste and components. By projecting structured light onto the PCB and analyzing the height variation with high-resolution imaging, the system can precisely detect defects such as floating components, shifts, coplanarity issues, and improper solder volume. This cutting-edge optical imaging technology ensures reliable 3D measurement, stable inspection results, and enhanced SMT production quality.
The 3D AOI's Intelligent Zero Reference Point Technology automatically creates a stable reference point to ensure precise height measurement. By eliminating the influence of PCB color variations, surface patterns, and board interference, this advanced algorithm delivers highly accurate 3D inspection results. It enhances measurement consistency and improves defect detection for high-density SMT production.
The Intelligent Coplanarity Inspection Technology combines precise coplanarity analysis with absolute height measurement to accurately detect lifted leads, tilted components, and uneven solder joints. By eliminating false calls caused by height variations, this advanced 3D AOI technology ensures reliable inspection results and improves overall SMT assembly quality.
The 3D Positioning Technology enables precise component positioning by analyzing accurate height data and filtering out silkscreen noise or PCB color variations. This advanced algorithm ensures stable and interference-free inspection, improving detection accuracy for complex PCB designs and high-density SMT production.
The 3D+Color Algorithm integrates precise height data with full-color imaging to accurately reconstruct component shapes and solder joints in all directions. This advanced analysis enhances defect detection for complex PCB assemblies, improves inspection reliability, and ensures high-quality results in modern SMT production.
The Ultra-high Range Reconstruction Technology enables the 3D AOI system to measure components up to 35mm in height with exceptional accuracy. By using advanced high-range 3D reconstruction algorithms, it significantly expands the inspection height capability and delivers precise 3D measurement results for tall or complex components, ensuring superior performance in modern SMT production.
Product Specifications
|
Category |
Item |
Cube+ |
Cube-D+ |
|
Image System |
Camera |
12MP industrial camera |
12MP industrial camera |
|
Resolution |
15μm, 12μm, 10μm |
15μm, 12μm, 10μm |
|
|
FOV |
60*45mm (12MP, 15μm) |
60*45mm (12MP, 15μm) |
|
|
Lighting |
4 color ring shape LED (RGBW) |
4 color ring shape LED (RGBW) |
|
|
Height Measurement Method |
4 way projectors |
4 way projectors |
|
|
Movement Structure |
X/Y Movement |
AC Servo (Dual drive) |
AC Servo (Dual drive) |
|
Platform |
Granite |
Granite |
|
|
Width Adjustment |
Automatic |
Automatic |
|
|
Transport Type |
Belt |
Belt |
|
|
Board Loading Direction |
Left to right or right to left (Select at order) |
Left to right or right to left (Select at order) |
|
|
Fixed Rail |
Single lane: 1st fixed rail; Dual lane: 1st & 3rd fixed rail or 1st & 4th fixed rail |
Dual lane: 1st & 3rd fixed rail or 1st & 4th fixed rail |
|
|
Hardware Configuration |
Operating System |
Win 10 |
Win 10 |
|
Communication |
Ethernet, SMEMA |
Ethernet, SMEMA |
|
|
Power Requirement |
Single phase 220V, 50/60Hz, 5A |
Single phase 220V, 50/60Hz, 5A |
|
|
Air Requirement |
0.4-0.6MPa |
0.4-0.6MPa |
|
|
Conveyor Height |
900±20mm |
900±20mm |
|
|
Equipment Dimensions |
L1140mm * D1360mm * H1620mm (Without tower light) |
Same |
|
|
Equipment Weight |
1100kg |
1150kg |
|
|
PCB Size |
Size |
5060~510510mm |
Dual lane: 5060~510320mmSingle lane: 5060~510560mm |
|
Thickness |
≤6.0mm |
≤6.0mm |
|
|
Warping |
±3.0mm |
±3.0mm |
|
|
Component Clearance |
Top clearance 25-50mm adjustable, Bottom clearance 45mm |
Same |
|
|
Clamping Edge |
3.0mm |
3.0mm |
|
|
PCB Weight |
≤3.0kg |
≤3.0kg |
|
|
Inspection Categories |
Component |
Wrong Component, Missing, Polarity, Shift, Reverse, Damage, IC Lead Bend, IC Lifted Lead, Foreign Material, Float, Coplanarity, Tombstone, etc. |
Same |
|
Solder Joint |
No Solder, Insufficient Solder, Open Solder, Excess Solder, Solder Bridge, Solder Ball, etc. |
Same |
|
|
Component Size |
Chip: 03015 and above (3D); LSI: 0.3mm pitch and above; Others: Odd shape component |
Same |
|
|
Measurable Range |
35mm (15μm) |
35mm (15μm) |
|
|
Inspection Speed |
450ms/FOV |
450ms/FOV |
Product data is for reference only. Please contact us to confirm the latest information.
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