Machine Introduction
The Fully Automatic Solder Paste Printer H1500 E is designed for high-precision SMT production, delivering stable, efficient, and repeatable printing performance. Equipped with an advanced CCD alignment system, high-rigidity printing platform, and intelligent motion control, it ensures accurate solder paste deposition across large PCB formats. Its modular structure, fast stencil cleaning system, and streamlined UI interface minimize downtime and simplify operation. With options for MES connectivity, traceability management, and automated process monitoring, the H1500-E provides manufacturers with a reliable, high-efficiency solution for modern intelligent electronics production.
Key Features
- High-precision alignment with advanced CCD vision and stable mark recognition.
- Large-format printing capability supporting oversized PCB applications.
- Rigid and stable platform to reduce board deformation and improve print quality.
- Intelligent control system with real-time monitoring and easy-to-use interface.
- Fast automatic cleaning system (dry/wet/vacuum) to maintain stencil quality.
- Modular design for easy maintenance and reduced downtime.
- MES/traceability compatible for Industry 4.0 production lines.
- High-speed and repeatable operation to maximize throughput.
The 1500×510 mm large-format printing platform, combined with a high-efficiency vacuum adsorption system, ensures precise substrate positioning and eliminates board warping. This stable and rigid platform design significantly enhances printing accuracy and overall production quality.
The optimized horizontal (X-direction) scraper system reduces solder paste consumption while ensuring uniform deposition. With a self-adaptive scraper arm and advanced control mechanism, it delivers consistent print quality even on large-format PCBs.
The fully automatic transmission system features flexible side clamping, automatic board thickness adjustment, and an efficient pressing module, reducing process time and operator workload. With a maximum 10 kg substrate transfer capacity, it delivers stronger performance and higher adaptability for diverse production needs.
The upgraded CCD positioning system features a 1.3 MP camera with a 10×8 mm FOV, ensuring precise alignment and full compatibility with various MARK types. With enhanced barcode scanning and closed-loop MES integration, it eliminates manual adjustment issues and significantly improves positioning efficiency and production stability.
The advanced cleaning system features an upper drip structure that automatically adjusts the wetting area to match substrate length. With dry, wet, and vacuum wiping modes combined with a sealed ring-type rubber strip, it ensures thorough stencil cleaning and significantly enhances printing quality.
Key Specifications
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Category |
Specification |
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Performance |
Repeated Positioning Accuracy: ±15 μm |
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Repeated Printing Precision: ±30 μm |
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Excluding Cleaning & Printing: < 1.2 sec |
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Processing CT: 6 min |
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Line Change CT: 4 min |
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Laminate Processing |
Laminate Dimension: 80×50 mm – 1500×510 mm |
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Laminate Thickness: 0.8–6 mm |
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Mechanical Range of Capture: 1500×510 mm |
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Maximum Laminate Weight: 100 kg |
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Marginal Gap: 3.5 mm |
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Height Over the Top: 15 mm |
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Transmission Height: 900 ± 40 mm |
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Max Transmission Speed: 1500 mm/s |
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Way of Transmission: One-section guide rail |
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Transmission Direction: Left→Right / Right→Left |
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Transmission In/Out: Same side |
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Laminate Support Method: Magnetic thimble (65 mm), Support blocks (65 mm) |
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Laminate Clamping: Self-adjustable platform, Manual pressing sheet, Flexible side clamps |
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Printing Parameters |
Printing Speed: 10–200 mm/s |
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Printing Pressure: 0.5–15 kg |
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Printing Mode: Single or Double |
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Scraper Type: Rubber / Steel (angle 45°/55°/60°) |
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Stripper Distance: 0–20 mm |
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Stripper Speed: 0–20 mm/s |
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Steel Mesh Size: 720×300 mm – 1180×750 mm |
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Mesh Positioning: Manual |
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Cleaning Parameters |
Cleaning System: Dry / Wet / Vacuum |
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Cleaning Position: Right |
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Cleaning Speed: 10–200 mm/s |
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Cleaning Fluid Usage: Auto & Manual |
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Cleaning Paper Usage: Auto & Manual |
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Vision Parameters |
FOV: 10×8 mm |
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Camera Type: 1.3 MP digital camera |
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Image Pickup System: Up-down imaging with adjustable light source |
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Capture Time: 300 ms |
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Datum Types: Circle, Square, Rhombus, Cross, Bonding pad |
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Mark Size: 0.5–6 mm |
Product data is for reference only. Please contact us to confirm the latest information.
Why Partner with Us
✓ More than just equipment supply - complete SMT line solutions
✓ Real project experience with installed and running SMT lines
✓ Strong engineering support for automation and integration
✓ Reduced integration risk and faster line start-up
✓ Dedicated technical support throughout the project lifecycle
About Us
We specialize in complete SMT line solutions and automation integration, delivering reliable equipment and proven production lines backed by real project experience.
Solder Paste Printer – FAQ
Q: 1. What is a solder paste printer used for in SMT production?
A: A solder paste printer is used in SMT production lines to accurately print solder paste onto PCB pads through a stencil. It is a critical process that directly affects soldering quality and overall assembly yield.
Q: 2. How does a solder paste printer work?
A: A solder paste printer works by aligning the PCB with the stencil and using a squeegee system to apply solder paste through stencil apertures onto the PCB pads. Accurate alignment and stable printing are essential for consistent results.
Q: 3. What types of solder paste printers are available?
A: Common types of solder paste printers include manual printers, semi-automatic printers, and fully automatic solder paste printers. Fully automatic printers are widely used in modern SMT production lines for high accuracy and high-volume manufacturing.
Q: 4. How important is printing accuracy in solder paste printing?
A: Printing accuracy is critical, as insufficient or excessive solder paste can cause defects such as bridging, solder balls, or insufficient solder joints. High-precision solder paste printers help ensure stable and repeatable printing results.
Q: 5. Can a solder paste printer be integrated with SPI systems?
A: Yes. A solder paste printer can be integrated with SPI (Solder Paste Inspection) systems to form a closed-loop process. This allows real-time feedback and automatic parameter adjustment to improve printing quality.
Q: 6. What factors affect solder paste printing quality?
A: Printing quality is influenced by stencil design, solder paste type, squeegee pressure and speed, PCB flatness, and printer alignment accuracy. Proper process setup is essential for reliable SMT production.
Q: 7. Is a solder paste printer suitable for lead-free SMT processes?
A: Yes. Modern solder paste printers are designed to support lead-free solder paste and meet the accuracy requirements of lead-free SMT processes.
Q: 8. What maintenance is required for a solder paste printer?
A: Routine maintenance includes cleaning the stencil, squeegee blades, and printing table, as well as checking alignment systems and mechanical components to maintain consistent printing performance.
Q: 9. How do I choose the right solder paste printer for my SMT line?
A: Choosing the right solder paste printer depends on PCB size, production volume, accuracy requirements, and level of automation. Working with an experienced SMT line solution provider helps ensure optimal printer selection and smooth line integration.
Q: 10. Can solder paste printers support automation and smart factory integration?
A: Yes. Advanced solder paste printers support automation features such as barcode reading, MES connectivity, automatic stencil cleaning, and line communication for smart SMT factory environments.
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