Machine Introduction
The Fully Automatic Solder Paste Printer GSE+ is engineered for high-precision SMT production, delivering exceptional stability, fast cycle time, and consistent print quality. Designed for modern electronics manufacturing, the GSE+ supports solder paste, flux, silver paste, glue and multiple advanced printing processes, making it ideal for high-mix and high-volume SMT lines. With its high-accuracy CCD vision system, intelligent cleaning module, flexible clamping mechanism and optimized transmission platform, the GSE+ ensures superior alignment, reduced defects, and reliable performance across various PCB sizes and materials. It is an all-in-one printing solution for manufacturers looking to improve throughput, accuracy, and long-term production efficiency.
Key Features
- High precision printing with ±12.5μm@6σ and stable closed-loop pressure control.
- Advanced CCD vision system supports multiple MARK types and optional barcode scanning.
- High-speed automatic cleaning system with dry, wet and vacuum modes for optimal stencil maintenance.
- Flexible PCB support system with vacuum platform and adaptive clamping to eliminate warpage.
- Optimized transmission and alignment ensuring smooth PCB loading and accurate positioning.
- User-friendly interface with real-time monitoring and intelligent software control.
- Compatible with multiple materials including solder paste, flux, silver paste, glue and more.
- Designed for high efficiency with fast cycle time and stable 24/7 production capability.
The Adjustable Mesh-Frame Pneumatic Cylinder delivers stable and precise screen frame control, featuring an auto-balanced pressure system for improved printing accuracy. Its modular design allows up to 50% faster component replacement, boosting uptime and overall production efficiency.
The structurally robust printing platform is designed to support different product sizes while maintaining high stability. It effectively prevents substrate buckling and deformation, ensuring smoother printing and better overall production quality.
The enhanced CCD positioning system delivers high-resolution 1.3MP imaging with a wide 8×6 mm FOV, ensuring accurate and stable alignment. It supports all MARK types and surface conditions, enabling reliable recognition for various products and production environments.
The intelligent MES system supports extended SECS/GEM communication protocols and ensures real-time product traceability. It enhances connectivity, data transparency, and production control for fully digitalized manufacturing.
The intuitive user-interface system provides clear process monitoring, real-time production data, and easy parameter adjustment. Its smart layout improves operational efficiency, reduces setup time, and enhances overall production control for stable, high-quality output.
The environmental control system ensures stable printing quality through precise real-time regulation of internal temperature and humidity. By maintaining optimal conditions, it reduces defects and enhances overall production consistency.
Machine Performance
|
Item |
Specification |
|
Repeat Position Accuracy |
±12.5 μm@6σ CPK≥2.0 |
|
Print Accuracy |
±22 μm@6σ CPK≥2.0 |
|
NCP Time |
5.5 s |
|
Process CT |
4 min |
|
Transfer Line CT |
2 min |
Substrate Processing Parameter
|
Item |
Specification |
|
Maximum Board Size |
400380 mm (Optional: 530380 mm) |
|
Minimum Board Size |
50*50 mm |
|
Board Thickness |
0.4–6 mm |
|
Camera Mechanical Range |
510*380 mm |
|
Maximum Board Weight |
4 kg |
|
Board Edge Clearance |
2.5 mm |
|
Board Height |
15 mm |
|
Transport Speed |
900 ± 40 mm |
|
Max Transport Speed |
1500 mm/s (Max) |
|
Transport Direction |
One stage |
|
Transmission Direction |
Left to right / Right to Left |
|
Transport In/out |
Same side |
|
Support System |
Magnetic Pin; 90 mm Support Block |
|
Board Clamping |
Manual Up-down table; Side clamping |
Printing Parameters
|
Item |
Specification |
|
Print Speed |
10–200 mm/sec |
|
Print Pressure |
0.5–10 kg |
|
Print Mode |
One/Twice |
|
Squeegee Type |
Rubber/Squeegee Blade (45°/55°/60°) |
|
Snap-off |
0–2 mm |
|
Snap-Speed |
0–20 mm/sec |
|
Template Frame Size |
470370 mm – 737737 mm (thickness 20–40 mm) |
|
Stencil Positioning Method |
Automatic X-direction positioning |
Cleaning Parameters
|
Item |
Specification |
|
Cleaning System |
Dry, Wet, Vacuum (three modes) |
|
High-speed Cleaning |
Integrated & weave cleaning |
|
Cleaning System |
Drip type |
|
Cleaning Process |
Automatic generation |
|
Cleaning Position |
Post cleaning |
|
Cleaning Speed |
10–200 mm/sec |
|
Cleaning Fluid Consumption |
Auto & Manual adjustable |
|
Paper Consumption |
Auto & Manual adjustable |
Vision Parameters
|
Item |
Specification |
|
CCD FOV |
8*6 mm |
|
Camera |
1.3 MP Industrial CCD Digital Camera |
|
Camera System |
Lock up/down optics structure |
|
Magic CT |
100 ms |
|
Fiducial Mark Types |
Standard fiducial shapes: round, square, diamond, cross |
|
MARK Point |
Automatic PAD and profile |
|
Mark Size |
0.15–0.5 mm |
|
Max Marks |
Max 4 pcs |
|
Stay-away Number |
Max 1 pcs |
Machine Parameter
|
Item |
Specification |
|
Power Source |
AC 220 ± 10%, 50/60 Hz, 2.2 kW |
|
Air Pressure |
4–6 kg/cm² |
|
Air Consumption |
Approx. 55 L/min |
|
Operating Temperature |
20–45 °C |
|
Working Environment Humidity |
30–60% |
|
Machine Dimension (Without Tower Light) |
1510 mm |
|
Machine Length |
1150 mm |
|
Machine Width |
1410 mm |
|
Machine Weight |
Approx. 690 kg |
Product data is for reference only. Please contact us to confirm the latest information.
Why Partner with Us
✓ More than just equipment supply - complete SMT line solutions
✓ Real project experience with installed and running SMT lines
✓ Strong engineering support for automation and integration
✓ Reduced integration risk and faster line start-up
✓ Dedicated technical support throughout the project lifecycle
About Us
We specialize in complete SMT line solutions and automation integration, delivering reliable equipment and proven production lines backed by real project experience.
Solder Paste Printer – FAQ
Q: 1. What is a solder paste printer used for in SMT production?
A: A solder paste printer is used in SMT production lines to accurately print solder paste onto PCB pads through a stencil. It is a critical process that directly affects soldering quality and overall assembly yield.
Q: 2. How does a solder paste printer work?
A: A solder paste printer works by aligning the PCB with the stencil and using a squeegee system to apply solder paste through stencil apertures onto the PCB pads. Accurate alignment and stable printing are essential for consistent results.
Q: 3. What types of solder paste printers are available?
A: Common types of solder paste printers include manual printers, semi-automatic printers, and fully automatic solder paste printers. Fully automatic printers are widely used in modern SMT production lines for high accuracy and high-volume manufacturing.
Q: 4. How important is printing accuracy in solder paste printing?
A: Printing accuracy is critical, as insufficient or excessive solder paste can cause defects such as bridging, solder balls, or insufficient solder joints. High-precision solder paste printers help ensure stable and repeatable printing results.
Q: 5. Can a solder paste printer be integrated with SPI systems?
A: Yes. A solder paste printer can be integrated with SPI (Solder Paste Inspection) systems to form a closed-loop process. This allows real-time feedback and automatic parameter adjustment to improve printing quality.
Q: 6. What factors affect solder paste printing quality?
A: Printing quality is influenced by stencil design, solder paste type, squeegee pressure and speed, PCB flatness, and printer alignment accuracy. Proper process setup is essential for reliable SMT production.
Q: 7. Is a solder paste printer suitable for lead-free SMT processes?
A: Yes. Modern solder paste printers are designed to support lead-free solder paste and meet the accuracy requirements of lead-free SMT processes.
Q: 8. What maintenance is required for a solder paste printer?
A: Routine maintenance includes cleaning the stencil, squeegee blades, and printing table, as well as checking alignment systems and mechanical components to maintain consistent printing performance.
Q: 9. How do I choose the right solder paste printer for my SMT line?
A: Choosing the right solder paste printer depends on PCB size, production volume, accuracy requirements, and level of automation. Working with an experienced SMT line solution provider helps ensure optimal printer selection and smooth line integration.
Q: 10. Can solder paste printers support automation and smart factory integration?
A: Yes. Advanced solder paste printers support automation features such as barcode reading, MES connectivity, automatic stencil cleaning, and line communication for smart SMT factory environments.
Hot Tags: fully automatic solder paste printer gse+, China fully automatic solder paste printer gse+ manufacturers, suppliers, factory, Fully Automatic PCB Solder Paste Printing Machine, Fully Automatic Solder Paste Printer for Mass Production, automatic solder paste printer, Fully Automatic Solder Paste Printer for Fine Pitch PCB, Fully Automatic Solder Paste Printer with Board Support System, Inline SMT Fully Automatic Solder Paste Printer