Machine Introduction
The Fully Automatic Solder Paste Printer G5 is designed for high-precision SMT production, delivering stable printing quality, fast cycle time, and excellent repeatability for fine-pitch components. Equipped with advanced vision alignment, automatic stencil cleaning, and closed-loop printing control, the G5 printer ensures consistent solder paste deposition and reduces defects in high-density PCB assembly. Its user-friendly interface, robust mechanical structure, and compatibility with various PCB sizes make it ideal for modern electronics manufacturing, from consumer electronics to automotive and industrial applications.
Features
High-precision vision alignment for stable and accurate solder paste printing
Automatic stencil cleaning system for consistent and reliable performance
Closed-loop printing control to ensure repeatability and reduce printing defects
Fast cycle time and optimized PCB handling for higher production efficiency
Supports a wide range of PCB sizes and fine-pitch components
User-friendly operation with intelligent interface and real-time monitoring
The special adjustment jacking platform offers a stable and easy-to-adjust structure, allowing rapid pin-height adjustment for PCBs of different thicknesses. Its reliable mechanical design ensures precise support during solder paste printing, improving print quality, alignment accuracy, and overall SMT process stability.
The advanced image and optical system uses uniform ring lighting and high-brightness coaxial illumination to ensure accurate recognition of all types of Mark points, including uneven or rugged marks. With adjustable brightness and strong adaptability to tin-plated, copper-plated, gold-plated, sprayed-tin, FPC, and multi-color PCBs, the system delivers high-precision alignment and consistently stable printing performance.
The user-friendly Chinese/English interface, based on Windows XP/Win7, offers intuitive navigation, smooth workflow guidance, and fast operator learning. With easy language switching, built-in operation logs, fault records, self-diagnosis, and real-time alarms, the system ensures efficient operation, quick troubleshooting, and simplified programming for SMT production.
The cleaning system supports dry, wet, and vacuum cleaning modes, which can be used individually or in combination to ensure efficient stencil maintenance. Its enhanced wiping system and powerful vacuum remove residual solder paste effectively, achieving reliable automatic cleaning. With the CCD and cleaning modules operating independently, motor load is reduced and machine speed and accuracy are significantly improved, resulting in higher printing quality and production efficiency.
The high-adaptability steel mesh frame clamping system supports screen frames of various sizes and enables fast model changes during production. Its flexible and stable clamping mechanism ensures secure stencil positioning, improving printing efficiency and reducing downtime in SMT manufacturing.
The guide rail positioning system features programmable flexible side clamps designed for FPC and warped PCBs, enabling precise top-side flattening and stable positioning. Through software-controlled automatic extension and retraction, the system adapts to PCB thickness variations without affecting alignment accuracy, ensuring consistent and reliable printing performance.
Technical Parameters
|
Category |
Parameter |
Value |
|
Machine Performance |
Repeat Position Accuracy |
±0.01 mm |
|
Machine Performance |
Print Accuracy |
±0.025 mm |
|
Machine Performance |
NCP-CT (No Cleaning Printing) |
7.5 s |
|
Machine Performance |
HCP-CT (Has Cleaning Printing) |
19 s/pcs |
|
Machine Performance |
SCT |
9 min |
|
Machine Performance |
HCT |
7 min |
|
Substrate Processing |
Maximum Board Size |
420 × 340 mm (standard), 530 × 340 mm (optional) |
|
Substrate Processing |
Minimum Board Size |
50 × 50 mm |
|
Substrate Processing |
Board Thickness |
0.4–6 mm |
|
Substrate Processing |
PCB Clamping Range |
53–340 mm |
|
Substrate Processing |
Maximum Board Weight |
3 kg |
|
Substrate Processing |
Board Edge Clearance |
2.5 mm |
|
Substrate Processing |
Max Board Height |
15 mm (with adjustable pin) |
|
Substrate Processing |
Transport Speed |
900 ± 40 mm/s |
|
Substrate Processing |
Track Width Adjustment |
15–340 mm (max 150 mm/s) |
|
Substrate Processing |
Transport Direction |
Left to Right / Right to Left |
|
Substrate Processing |
Conveyor Level |
900 ± 40 mm |
|
Substrate Processing |
In/Out Transmission Direction |
Same height in and out |
|
Support System |
Support Type |
Magnetic Pin |
|
Support System |
Block Type |
Support Block |
|
Support System |
Platform |
Manual Up-Down Table |
|
Support System |
Damping |
Automatic Top Damping |
|
Support System |
Board Clamp |
Side Clamping |
|
Support System |
Adsorption |
Adsorption Function |
|
Printing Parameters |
Print Speed |
10–200 mm/sec |
|
Printing Parameters |
Print Pressure |
0.4–1.0 kg |
|
Printing Parameters |
Print Mode |
One / Twice |
|
Printing Parameters |
Squeegee Type |
Rubber / Squeegee Blade (45/55/60) |
|
Printing Parameters |
Squeegee Snap-off |
0–20 mm |
|
Printing Parameters |
Squeegee Speed |
10–200 mm/sec |
|
Printing Parameters |
Frame Size |
470 × 370 mm – 737 × 737 mm |
|
Cleaning System |
Cleaning Methods |
Dry / Wet / Vacuum (3 modes) |
|
Cleaning System |
Cleaning Speed |
10–200 mm/sec |
|
Cleaning System |
Cleaning Pressure |
Adjustable |
|
Cleaning System |
Cleaning Stroke |
Automatic Generation |
|
Cleaning System |
Cleaning Position |
Post Cleaning |
|
Cleaning System |
Cleaning Speed Control |
10–200 mm/sec |
|
Cleaning System |
Cleaning Paper Consumption |
Auto & Manually Adjustable |
|
Cleaning System |
Cleaning Agent Control |
Auto & Manually Adjustable |
|
Vision Parameters |
CCD FOV |
10 × 8 mm |
|
Vision Parameters |
Camera Type |
1.3M–5M CCD Digital Camera |
|
Vision Parameters |
Camera System |
Up/Down Digital Imaging System |
|
Vision Parameters |
Camera Cycle Time |
≤300 ms |
|
Vision Parameters |
Fiducial Types |
Round, Square, Diamond, Cross |
|
Vision Parameters |
Mark Size |
0.5–5 mm |
|
Vision Parameters |
Mark Quantity |
Max 1 pcs |
|
Machine Parameter |
Power Source |
AC220 ± 10%, 50/60 Hz, 2.2 kW |
|
Machine Parameter |
Air Pressure |
4–6 kgf/cm² |
|
Machine Parameter |
Working Environment Temp |
10–35°C |
|
Machine Parameter |
Working Environment Humidity |
30–60% |
|
Machine Parameter |
Machine Size (L×D×H) |
1164 × 1330 × 1444 mm |
|
Machine Parameter |
Machine Weight |
≈ 910 kg |
|
Machine Parameter |
Floor Bearing Requirement |
650 kg/m² |
Product data is for reference only. Please contact us to confirm the latest information.
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