Machine introduction
The Fully Automatic Solder Paste Printer G9 is engineered for high-precision, high-efficiency SMT production, delivering superior alignment accuracy, stable printing performance, and fast cycle times for fine-pitch and high-density PCBs. Equipped with an advanced optical system, intelligent cleaning module, adaptive clamping mechanics, and a user-friendly multilingual interface, the G9+ ensures consistent solder paste deposition and reduces defects across various PCB types including FPC, HDI, and multi-layer boards. Its robust structure, automated features, and compatibility with modern SMT production lines make it an ideal solution for achieving higher throughput and reliability in electronics manufacturing.
Features
High-precision vision alignment with multi-mode optical recognition
Automatic cleaning system supporting dry, wet, and vacuum modes
Adaptive clamping and guide rail system for warped, thin, and flexible PCBs
Fast stencil change and high-adaptability frame clamping mechanism
User-friendly Chinese/English interface with fault logs and self-diagnosis
Stable jacking platform for quick PCB thickness adjustment
Compatible with diverse PCB materials and surface finishes
Designed for high-speed, high-repeatability SMT printing environments
The advanced CCD digital camera system features a redesigned optical path with uniform circular lighting and high-brightness coaxial illumination, ensuring precise recognition of all types of fiducial marks, including uneven or reflective surfaces. With adjustable brightness and dual-light-source control, the system delivers high-accuracy alignment across various PCB materials such as tin-plated, copper-plated, gold-plated, silver-plated, and FPC boards, guaranteeing stable and reliable solder paste printing performance.
The highly precise PCB thickness adjustment table features a robust and stable XY structure, allowing smooth lifting and manual fine-tuning to accommodate different PCB thicknesses with ease. Its reliable mechanical design ensures accurate PCB positioning, improving printing stability and overall SMT process consistency.
The advanced guide rail positioning system features a detachable, programmable flexible side clamp designed to stabilize FPC and warped PCBs. Its unique clamping structure delivers precise top-side flattening, while software-controlled automatic extension and retraction adapt to varying PCB thickness without affecting alignment accuracy, ensuring consistent and reliable printing performance.
The innovative squeegee structure design adopts a hybrid squeegee system that significantly improves printing stability and extends overall service life. This advanced configuration ensures consistent pressure control, smoother printing performance, and enhanced durability for high-precision SMT solder paste applications.
The high-speed stencil cleaning system features a downward dispensing structure that prevents clogged apertures and ensures consistent stencil cleanliness. With precise solvent-control software and efficient wiping performance, it enhances printing quality, reduces defects, and improves overall SMT production stability.
The new multi-function interface features a clean and intuitive layout designed for fast and user-friendly operation. With real-time temperature and humidity monitoring, it enhances process control and ensures stable SMT printing performance. Ideal for improving efficiency and ease of use on modern production lines.
Technical Specifications
|
Category |
Item |
Specification |
|
Machine Performance |
Repeat Position Accuracy |
±0.01mm/6σ, CPK≥2.0 |
|
|
Print Accuracy |
±0.025mm/6σ, CPK≥2.0 |
|
|
NCP-CT (Non-contact Print) |
7s |
|
|
HOP-CT (High-speed Print) |
18s/pcs |
|
|
SPC-CT |
9min |
|
|
Start-up Time |
3min |
|
Substrate Processing Parameter |
Maximum board size |
Single 470×370mm; Double 530×340mm (optional) |
|
|
Minimum board size |
50×50mm |
|
|
Board thickness |
0.4–6mm |
|
|
Camera mechanical range |
828×490mm |
|
|
Maximum board weight |
3kg |
|
|
Board edge clearance |
2.5mm |
|
|
Board height |
15mm (excluding PCB thickness) |
|
|
Transport speed |
50–1500mm/s |
|
|
Max. transport speed |
1500mm/s |
|
|
Transport direction |
Left to right / Right to Left |
|
|
Transmission direction |
In and out the same |
|
Support System |
Support System |
Magnetic pin / Support block |
|
|
Automatic top table |
Manual up-down table |
|
|
Automatic top damping |
Yes |
|
|
Board clamp |
Side clamping |
|
|
Adsorption function |
Optional |
|
Printing Parameters |
Print speed |
10–200mm/s |
|
|
Print pressure |
0.5–10kg |
|
|
Print mode |
One/Twice |
|
|
Squeegee type |
Rubber/Metal (45/55/60 degrees) |
|
|
Squeegee stroke |
0–20mm |
|
|
Snap-off |
0–20mm/sec |
|
|
Max stencil frame size |
470×370mm–737×737mm (optional 420×420mm) |
|
Cleaning Parameters |
Cleaning system |
Dry, Wet, Vacuum |
|
|
Cleaning method |
Up/Down type |
|
|
Cleaning solvent |
Automatic generation |
|
|
Cleaning speed |
10–200mm/sec |
|
|
Cleaning Papercore consumption |
Auto & manually adjustable |
|
|
Cleaning power consumption |
Automatic/manual adjustable |
|
Vision Parameters |
CCD FOV |
10×8mm |
|
|
Camera type |
1.3M / 2M industrial CCD |
|
|
Camera system |
Look-up/look-down structure |
|
|
Camera cycle time |
≤300ms |
|
Fiducial Mark |
Fiducial mark types |
Round, square, diamond, cross |
|
|
Mark size |
0.5–5mm |
|
|
Mark number |
Max 4pcs |
|
Machine Parameter |
Power source |
AC220±10%, 50/60Hz, 2.2kW |
|
|
Air pressure |
4–6kg/cm² |
|
|
Operating temperature |
20–55°C |
|
|
Operating humidity |
30–98% |
|
|
Machine dimension (without tower light) |
L1164 × W1341 × H1441mm |
|
|
Machine weight |
Approx. 890kg |
|
|
Equipment load bearing |
650kg/m² |
Product data is for reference only. Please contact us to confirm the latest information.
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