Machine Introduction
The V5000 Series Inline AOI is automated optical inspection system designed for high-precision and high-speed inspection across both pre-reflow and post-reflow processes. Built with a granite platform and telecentric lens, it delivers exceptional stability and accuracy for SMT production. Its advanced software algorithms effectively detect poor soldering, component defects, and PCB deformation, making it ideal for rigid boards and FPC applications. Real-time SPC analysis and full-line connectivity help improve process control and overall manufacturing quality.
Features
- Granite platform and telecentric lens ensure high accuracy and measurement stability.
- Advanced inspection algorithms provide reliable detection of excess solder, missing components, polarity, shift, tombstone, solder bridge, and more.
- Intelligent compensation reduces false calls caused by PCB warpage, temperature deformation, or silk-screen interference.
- Supports pre-reflow and post-reflow inline inspection for complete SMT process coverage.
- Three-point data connection integrates SPI, pre-reflow AOI, and post-reflow AOI for root-cause analysis.
- Automatic program switching through barcode scanning and full MES command support.
- SPC alarm function enables real-time production monitoring and improves defect prevention.
- Full-board photo output enhances traceability and quality documentation.
- Multiple repair stations can be linked to a single operator for improved efficiency.
Production Line Solution
Example Inspection
Intelligent Solder Pad Positioning for Enhanced Inspection Accuracy
Our advanced Solder Pad Positioning and FOV-assisted alignment technology greatly reduce false calls caused by PCB deformation, warpage, silkscreen variation, and legend interference. This intelligent positioning is especially effective for FPC and post-wave-soldering boards, ensuring stable detection of solder joints and components. By improving alignment accuracy across the entire field of view, the system delivers more reliable inspection results and boosts overall SMT quality performance.
Precise Poor Soldering Inspection for Chips and ICs
With accurate solder pad positioning and eight feature-point analysis, the system effectively identifies poor soldering defects on chips and ICs. By capturing solder shape abnormalities, insufficient solder, or weak joints, this technology delivers highly reliable inspection performance and ensures stable SMT assembly quality.
IPC-Compliant Detection Parameters for Higher Accuracy
Our algorithm calculates component offsets based on IPC-A-610-G Class 3 standards, ensuring more reliable and consistent inspection results. By precisely positioning the solder pad and component body, the system accurately computes shift rate and detects overhang within the IPC-defined tolerance of less than 25%, delivering stable quality control for demanding SMT applications.
Product Specification
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Equipment Model |
V5000 |
V5000D |
V5000XL |
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Image System |
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Camera |
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5MP/12MP industrial camera |
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Resolution |
5MP camera: 15μm, 10μm |
12MP camera: 15μm, 12μm, 10μm, 6.3μm |
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FOV |
37*30mm (5MP, 15μm) |
60*45mm (12MP, 15μm) |
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Lens |
Telecentric lens |
Telecentric lens |
Telecentric lens |
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Lighting |
4 color ring shape LED (RGBW) |
4 color ring shape LED (RGBW) |
4 color ring shape LED (RGBW) |
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Movement Structure |
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X/Y Movement |
AC Servo |
AC Servo |
AC Servo (Dual drive) |
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Platform |
Granite |
Granite |
Granite |
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Width Adjustment |
Automatic |
Automatic |
Automatic |
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Transport Type |
Belt |
Belt |
Belt |
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Board Loading Direction |
Left to right or right to left (Select at point of order) |
Same |
Same |
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Fixed Rail |
Single Lane: 1st fixed rail |
Dual Lane: 1st & 3rd fixed rail or 1st & 4th fixed rail |
Single Lane: 1st fixed rail |
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Hardware Configuration |
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Operating System |
Win 10 |
Win 10 |
Win 10 |
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Communication |
Ethernet, SMEMA |
Ethernet, SMEMA |
Ethernet, SMEMA |
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Power Requirement |
Single phase 220V, 50/60Hz, 5A |
Same |
Same |
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Air Requirement |
0.4–0.6MPa |
0.4–0.6MPa |
0.4–0.6MPa |
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Conveyor Height |
900±20mm |
900±20mm |
900±20mm |
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Equipment Dimensions |
L935*D1360*H1570mm (Without tower light) |
Same |
L1125*D1360*H1570mm (Without tower light) |
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Equipment Weight |
900kg |
950kg |
1100kg |
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PCB Size |
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Size |
50*60–510*610mm |
Dual lane: 50*60–510*320mm; Single lane: 50*60–510*580mm |
50*80–675*610mm |
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Thickness |
0.6–6.0mm |
0.6–6.0mm |
0.6–6.0mm |
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PCB Weight |
≤3kg |
≤3kg |
≤3kg |
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Component Clearance |
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Top clearance 25–60mm adjustable; Bottom clearance 45mm |
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Clamping Edge |
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3.0mm |
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Inspection Functions |
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Component |
Wrong Component, Missing, Polarity, Shift, Reverse, Damage, IC Lead Bend, Foreign Material, Tombstone, etc. |
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Solder Joint |
No Solder, Insufficient Solder, Open Solder, Excess Solder, Solder Bridge, Solder Ball, etc. |
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Component Size |
Chip: 03015 and above; LSI: 0.3mm pitch and above; Others: Odd shape component |
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Inspection Speed |
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180–200ms/FOV |
Product data is for reference only. Please contact us to confirm the latest information.
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