Desktop Automated Optical Inspection System

The A10 Offline Desktop Automated Optical Inspection System AOI is designed for high-precision offline PCBA inspection in SMT and wave soldering production. Equipped with a self-developed AI engine, advanced positioning technology, and a powerful feature-analysis algorithm, the A10 provides fast programming, stable inspection performance, and excellent adaptability for various PCB types. Its granite platform, industrial camera system, and intelligent data processing ensure reliable detection for solder joints, SMT components, through-hole parts, and odd-shape components.

• AI-assisted easy programming
• High-precision inspection for SMT & wave soldering
• Automatic thru-hole and solder joint detection
• Granite platform for imaging stability
• Effective warpage & deformation compensation
• Intelligent solder pad positioning to reduce false calls
• Supports odd-shape component inspection
• SPC reporting & full-board image output
• Remote judgement and offline programming support

AI Technology Application in Industrial Visual Inspection

Our advanced AI deep learning system uses a big-data recursive process to automatically learn and classify a wide range of defect features. This intelligent algorithm significantly improves programming efficiency, reduces manual setup time, and enhances detection accuracy. By integrating AI with industrial visual inspection, manufacturers can achieve smarter automation, faster quality control, and more reliable defect analysis across SMT, PCB, and electronic assembly lines.

AI Inspection for Poor Soldering

Our AI-powered soldering inspection system uses a mature deep-learning model trained on large-scale manufacturing data to precisely identify multiple types of poor soldering. By automatically recognizing defects such as insufficient solder, weak joints, and uneven wetting, the system delivers highly accurate inspection results with low false calls. This advanced AI technology helps improve quality control, reduce rework, and enhance overall SMT production efficiency.

AI Wave Soldering Inspection for Through-Hole Components

Our advanced wave soldering inspection algorithm combines big data with AI technology to accurately evaluate the solder joints of through-hole components across the entire PCB. With a one-click detection function, the system can efficiently identify common wave-soldering defects such as missing pins, blowholes, insufficient solder, and solder balls. This intelligent inspection solution significantly improves quality control, reduces manual judgment, and enhances overall production reliability for THT assembly lines.

Intelligent Solder Pad Positioning + Full FOV Assisted Alignment

Our proprietary Intelligent Solder Pad Positioning technology effectively reduces false calls caused by PCB deformation after wave soldering-especially on FPC boards where warpage is more severe. By combining full FOV assisted alignment, the system further minimizes false calls related to PCB warpage, silkscreen printing variation, and interference from board legends. This advanced positioning algorithm ensures stable inspection accuracy and improves overall AOI performance across diverse PCB types.

Product data is for reference only. Please contact us to confirm the latest information.

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