Machine Introduction

The Panasonic NPM-W2 Pick and Place Machine Series placement system delivers high-area productivity and stable high-accuracy mounting for modern SMT production lines.
With its advanced lightweight 16NH V3A head, dual-mode high-speed operation, and next-generation multi-recognition camera, the NPM enables manufacturers to achieve faster tact time, higher component quality, and more flexible line configurations.

This platform is designed for factories pursuing maximum output, micro-component precision, LED mounting stability, and large-lot/high-mix production.
Its optimized structural rigidity, improved X/Y acceleration, and intelligent recognition algorithms ensure consistent performance for 03015 to large components across various PCB types.

Key Features

1. Ultra-High Productivity & Speed

High-production mode up to 84,000 CPH
Optimized 16NH V3A lightweight head improves acceleration & routing efficiency
Supports Alternate / Independent / Hybrid placement for maximum throughput

2. High-Accuracy Placement

Accuracy up to ±30 μm(option ±25 μm)
Enhanced rigidity and vibration control for stable fine-pitch mounting
Reliable placement performance on 0402 / 0603 / 03015 mm components

3. Next-Generation Multi-Recognition Camera

3-in-1 recognition system: 2D, 3D and height measurement
Faster recognition scan, improved component identification
Upgradable from 2D → 3D for more complex packages

4. Lightweight 16NH V3A Head

Simultaneous X/Y movement during recognition for quicker tact time
Higher allowable component size
Ideal for diversified SMT applications

High-Speed & High-Accuracy Placement with 16NH V3A and Multi-Recognition Camera

The NPM placement platform achieves outstanding productivity and precision through its high-production mode (up to 84,000 CPH) and high-accuracy mode (up to 70,000 CPH, ±30 μm). The new Lightweight 16NH V3A head drives the X- and Y-axes simultaneously during parts recognition, significantly reducing tact time and increasing placement speed for small components such as 0402 / 0603 mm chips. Component versatility is also improved thanks to an increased allowable component size.

Equipped with an advanced multi-recognition camera, the system integrates three recognition functions into one unit, enabling faster scanning, component height detection, and optional 2D-to-3D upgradability. The improved rigidity and X/Y acceleration enhance both speed and stability, delivering reliable high-accuracy placement for dense boards and fine-pitch components.

Machine Configuration Overview

The NPM system offers flexible machine configurations to support a wide range of production needs. With Rear & Front Feeder Layout, up to 60 tape feeders can be mounted for high-mix component supply. The Single Tray Layout provides 13 fixed tray slots, enabling PoP tray handling through a multifunctional transfer unit. For maximum efficiency, the Twin Tray Layout allows simultaneous production and preparation, where one tray runs current jobs while the other is pre-staged for the next batch. Additionally, automated feeder maintenance units (IFMU / FMU) and head maintenance units enhance overall stability and reduce downtime, ensuring continuous and reliable SMT production.

Versatile Large-Board & LED Placement Capability

The NPM platform delivers exceptional versatility for modern SMT production. It supports large PCB handling with both single and dual-conveyor options, enabling stable transfer of boards up to 750 × 550 mm. For component diversity, the system accommodates large components up to 135 × 135 mm with a maximum placement load of 100 N, making it ideal for power devices, connectors, and automotive modules.

In LED manufacturing applications, the machine offers advanced brightness binning to avoid mixing brightness levels and minimize scrap rate. It automatically monitors remaining LED quantities to prevent component exhaustion and supports multiple LED nozzle shapes. Additional functions like global fiducial mark recognition, reduced travel distance, and machine standby help maintain smooth operation and reduce PCB changeover time.

This combination of large-board flexibility and specialized LED placement technology makes the NPM series a high-efficiency solution for diverse electronics manufacturing environments.

High Productivity & Dual Mounting

The NPM platform maximizes SMT throughput with Alternate, Independent, and Hybrid placement modes, enabling continuous production without PCB transfer loss. Dual-lane independent changeover allows feeder cart replacement during operation, reducing downtime. Automated support-pin replacement (option) and precise placement-height control further improve quality while minimizing operator workload. Feeder locations are fully flexible, allowing rapid job changeover and higher operating rates.

APC-5M & APC System｜Real-Time Monitoring for Stable SMT Quality

The APC-5M real-time monitoring system continuously tracks nozzle, filter, and feeder conditions, providing early warnings before errors impact production. With automatic feedback loops-APC-FB for printing, APC-FF for placement, and APC-MFB2 for AOI feedback-the machine corrects misalignment, placement offsets, and component height variations automatically. This closed-loop control improves placement accuracy, reduces defects, and keeps SMT production running with maximum stability.

PCB Information Communication & Parts Supply Navigation

The NPM platform enhances production efficiency with intelligent parts-supply navigation and real-time PCB mark communication. The system analyzes remaining component run-out time and guides operators with optimized supply priorities to minimize waiting and walking time. At the same time, PCB fiducial and pattern-mark data captured on the first machine are automatically shared with downstream equipment, reducing recognition time and improving line takt. This combined system ensures smoother component supply, faster PCB handling, and higher overall production stability.

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NPM-W2 Specification Table

Model Comparison Table

Model	Lightweight 16-Nozzle Head V3A	12-Nozzle Head	Lightweight 8-Nozzle Head	3-Nozzle Head V2	Dispensing Head	No Head
Placement Speed	42,000 cph (0.086 s/chip)	35,000 cph (0.103 s/chip)	21,250 cph (0.173 s/chip)	8,820 cph (0.433 s/chip)	-	-
High-Accuracy Mode Speed	-	31,250 cph (0.115 s/chip)	-	6,500 cph (0.554 s/QFP)	-	-
Placement Accuracy	±40 μm	±30 μm (optional ±25 μm)	±30 μm / QFP	±30 μm / QFP	-	-
Component Size	0402 → L8.5 × W8.5 × T3 / T6	03015–□ (0402–chip)	0402 → L4.5 × W4.5 × T12	0603 → L8–15 × W9–15 × T10	-	-
Component Supply	Tape 4/8/12/16/24/32/44/56 mm	Tray optional	Tape 4–56/72 mm	Tape 4–56/72/88/104 mm	Max.30 (single-stick feeder)	-

Dispensing / Inspection

Function	Specification
Dispensing Method	Dot dispensing / Line dispensing
Dispensing Speed	0.165 s/dot (XY:10 mm, Z:15 mm, θ: no rotation)
Adhesive Position Accuracy	±75 μm / dot
Applicable Components	SOP, PLCC, QFP, Connector, BGA, CSP
Inspection Method	2D Inspection (Type A / B)
Resolution	18 μm (Type A), 19 μm (Type B)
View Size	44.4 × 37.2 mm (Type A), 21.1 × 17.6 mm (Type B)
Inspection Accuracy	±20 μm
Component Types Detected	Missing, shift, flipping, polarity, rotation, solder shape

Machine Dimensions & Power

Item	Specification
Machine Size	W 1,280 mm × D 2,465 mm × H 1,444 mm
Mass	2,850 kg (Front head) / 2,780 kg (Rear head)
PCB Support (Single Conveyor)	L 50–550 mm × W 50–510 mm
PCB Support (Dual Conveyor)	L 50–510 mm × W 50–260 mm
Power Supply	3-phase AC 200–480 V, 2.8 kVA
Pneumatic Source	0.5 MPa, 200 L/min

Product data is for reference only. Please contact us to confirm the latest information.

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