NPM-GW High-Speed Modular Placement Machine
The Panasonic NPM-GW Pick and Place Machine is Panasonic's latest high-performance SMT placement platform designed for modern high-mix and high-volume production. Equipped with advanced placement heads, dual-conveyor architecture, and expanded PCB size capability, it delivers outstanding speed, accuracy, and flexibility for a wide range of electronics manufacturing needs.
With real-time APC-5M monitoring, automatic error correction, and intelligent feedforward/feedback control, the NPM-GW ensures stable, autonomous production with minimal operator intervention. Its smart-factory-ready design supports digital traceability, optimized material flow, and seamless integration into Industry 4.0 environments.
Engineered for maximum productivity and reliability, the NPM-GW helps manufacturers achieve higher throughput, improved placement quality, and lower overall production costs.
Key Features
1. Enhanced Core Performance for Higher Productivity
Our upgraded core drive system delivers a significant boost in placement capacity across different head configurations, ensuring faster cycle time and improved production efficiency.

2. Improved Component Support & Larger Process Window
The new placement architecture provides greater compatibility with tall, heavy, and large-sized components, while maintaining top-level accuracy.

3. Significantly Increased PCB Handling Flexibility
With the upgraded conveyor system, the machine now supports larger PCB sizes and greater adaptability for both single-lane and dual-lane production modes.

4. Greater Versatility in Feeder & Supply Units
The machine supports multiple feeder configurations, allowing manufacturers to adapt to different component types with ease.

Autonomous 5Ms Control – Intelligent APC System
1. APC-5M Real-Time Monitoring for Stable Production
Our APC-5M system continuously monitors key machine units in real time, instantly detecting variation trends before they impact production.
Monitored Units
Placement head – clog detection, nozzle sliding, filter clogging
Nozzle system – nozzle condition, nozzle clogging, sliding issues
Feeder – pickup accuracy monitoring
Target unit data displayed on machine & LPC screen
Benefits
✔ Prevent unexpected downtime
✔ Schedule maintenance at optimal timing
✔ Maintain stable quality with automated notifications

2. Closed-Loop Control for Printing, Placement & AOI
The APC platform provides full-process feedback control, minimizing variation and improving long-term placement stability.
APC-FB - Feedback to the Printing Process
- Analyzes solder inspection results
- Automatically corrects printing misalignment (X, Y, θ)
APC-FF - Feedforward to the Placement Head
- Uses solder joint measurement data
- Auto-adjusts placement positions (X, Y, θ) for optimal accuracy
- Supports QFP, BGA, C components & more
APC-MFB2 - Feedforward to AOI / Feedback to Placement Machine
- Utilizes AOI position measurement
- Auto-corrects chip placement (X, Y, θ)
- Ideal for ultra-small, lightweight, low-force components
★ Ensures consistent soldering quality across the entire line.

3. Automatic Pickup Error Correction (Nonstop Production)
When a pickup or recognition error occurs, the system automatically learns the correction pattern and resumes production without stopping.
- Smart Automatic Teach-In
- Real-time correction of pickup errors
- Automatic feed position re-learning
- No manual intervention required
- Maximizes machine uptime
★ Achieve continuous production with automatic recovery after pickup correction.

4. Predictive Recovery with Automatic Trend Analysis
The LNB system analyzes pickup trends, error frequency, and component condition, then instructs the machine to auto-teach before an error causes a stop.
Predictive Error Prevention
- Automatic detection of pickup trend variations
- Condition monitoring of components & feeders
- Automated recovery / teach-in before errors occur
⭐ Advanced predictive control significantly reduces machine stoppages.

5. LCR Checker - Real-Time Component Verification
The integrated LCR checker performs electrical checks at the start of production or during material replenishment.
Checks Performed
- Resistance
- Capacitance
- Inductance
- Diode characteristics
Key Benefits
- Prevents wrong reels or defective components
- Ensures component quality before mounting
- Data exported to LNB → usable for traceability & quality control
- Supports component size 0402 to 6 mm
★ Critical for EMS factories seeking traceability and zero-defect production.

Technical Specifications
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Model ID |
NPM-GW |
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Model No. |
NM-EJM2F |
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PCB dimensions – Single conveyor |
Batch mounting: L 50 mm × W 50 mm to L 760 mm × W 687 mm |
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PCB dimensions – Dual conveyor |
2-position mounting: L 50 mm × W 50 mm to L 360 mm × W 687 mm |
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Dual transfer (Batch) – PC size |
L 50 mm × W 50 mm to L 760 mm × W 300 mm |
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Dual transfer (Batch) – M size |
L 50 mm × W 50 mm to L 760 mm × W 590 mm |
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Single transfer (Batch) – PC size |
L 50 mm × W 50 mm to L 760 mm × W 300 mm |
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Single transfer (Batch) – M size |
L 50 mm × W 50 mm to L 760 mm × W 590 mm |
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Dual transfer (2-position) – PC size |
L 50 mm × W 50 mm to L 360 mm × W 300 mm |
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Dual transfer (2-position) – M size |
L 50 mm × W 50 mm to L 360 mm × W 260 mm |
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Single transfer (2-position) – PC size |
L 50 mm × W 50 mm to L 360 mm × W 300 mm |
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Single transfer (2-position) – M size |
L 50 mm × W 50 mm to L 360 mm × W 510 mm |
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Electric source |
3-phase AC 200, 220, 380, 400, 420, 480 V / 2.5 kVA |
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Pneumatic source |
Min. 0.5 MPa, 200 L/min (A.N.R.) |
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Dimensions (Standard) |
W 1 410 mm × D 2 320 mm × H 1 444 mm |
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Dimensions (Option) |
W 1 410 mm × D 2 468 mm × H 1 444 mm |
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Mass (Standard) |
2 810 kg |
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Mass (Option) |
2 840 kg |
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Placement head – FC16 (per head) – Max speed |
52 000 cph (0.070 s/chip) |
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Placement head – FC16 placement accuracy |
±25 μm / chip |
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Placement head – FC08 (per head) – Max speed |
26 500 cph (0.136 s/chip) |
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Placement head – FC08 placement accuracy |
±25 μm / QFP |
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Placement head – FC03 (per head) – Max speed |
10 000 cph (0.360 s/chip) |
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Placement head – FC03 placement accuracy |
±20 μm / QFP |
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Component Dimensions – FC16 |
0201 chip to L 45 × W 45 × T 12 or L 100 × W 40 × T 12 |
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Component Dimensions – FC08 |
0402 chip to L 45 × W 45 or L 100 × W 40 × T 12 |
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Component Dimensions – FC03 |
0603 chip to L 120 × W 90 × T 30 or L 150 × W 25 × T 40 or L 135 × W 135 × T 18 |
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Component Supply – Taping |
Tape: 4 / 8 / 12 / 16 / 24 / 32 / 44 / 56 mm |
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Component Supply – Stick |
Max 136 (SF3-m) |
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Component Supply – Tray |
4 to 56 / 72 mm |
Product data is for reference only. Please contact us to confirm the latest information.
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