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Underfill Adhesive Automated Optical Inspection System

Underfill Adhesive Automated Optical Inspection System

The Underfill Adhesive Automated Optical Inspection System AOI series (VF5100 single-side, VF5300 double-side) is designed for high-precision inspection of underfill adhesive climbing height, coverage, and defects around component edges. With advanced multi-angle imaging, UV/RGBW lighting, and a dedicated side-view optical system, the machine delivers accurate detection of UF adhesive, UV adhesive, RTV adhesive, and heat-dissipation materials. It supports inline inspection in dispensing and coating production lines, ensuring process stability and improving product reliability.

Machine Introduction

 

The Underfill Adhesive Automated Optical Inspection System AOI series (VF5100 single-side, VF5300 double-side) is designed for high-precision inspection of underfill adhesive climbing height, coverage, and defects around component edges. With advanced multi-angle imaging, UV/RGBW lighting, and a dedicated side-view optical system, the machine delivers accurate detection of UF adhesive, UV adhesive, RTV adhesive, and heat-dissipation materials. It supports inline inspection in dispensing and coating production lines, ensuring process stability and improving product reliability.

 

Key Features

 

  • Five-sided inspection to capture adhesive conditions around all component edges.
  • High-precision measurement of underfill adhesive climbing height and climbing percentage.
  • Auto-generated contour lines for clear adhesive boundary visualization.
  • UV, RGBW, and coaxial lighting for multi-material compatibility including UF, UV, RTV, and thermal adhesives.
  • Real-image AI bubble inspection trained by production data for accurate bubble detection.
  • Inline inspection capability for integration with dispensing and coating equipment.
  • Save and review 5-side images for SPC analysis, traceability, and MES connection.
  • Centralized control and remote management to improve production efficiency and reduce downtime.
  • Closed-loop feedback enabling communication with dispensing/coating machines to optimize adhesive processes.

 

Production Line Solution

 

Underfill AOI for Insufficient Underfill

Our advanced side-view inspection system uses the innovative Sham optical principle to deliver clearer, wider imaging when capturing tilted PCB surfaces. By expanding the effective depth of field, the Sham lens ensures sharper edge details and more accurate defect detection compared with standard cameras. This enhanced optical design improves side inspection performance, boosts reliability, and supports high-precision SMT quality control.

AOI for Underfill Fillet Inspection

The inspection system features UV light, RGBW light, and coaxial light options, allowing flexible illumination selection based on different adhesive materials. With optimized lighting combinations, the machine enhances contrast, improves defect visibility, and ensures accurate and consistent inspection results for SMT applications.

AOI for Underfill Adhesive Spread Detection

 

Examples Inspection

 

SMT Underfill Adhesive AOI System

The system supports five-sided inspection, enabling comprehensive coverage of component sides that a standard front camera cannot physically capture. By combining multiple angled lenses, the machine ensures complete detection of side defects, enhances inspection accuracy, and improves overall reliability for high-density SMT assemblies.

AOI for Underfill Adhesive Area Verification

The system provides inline measurement of UF adhesive climbing height using a calibrated side-view camera solution. It accurately detects the relative climbing height and coverage percentage of underfill adhesive, ensuring precise process control, improved bonding reliability, and stable quality in advanced semiconductor packaging.

Automated Optical Inspection for Underfill Process

This system provides automated conformal coating bubble inspection using AI models trained on real production images. It accurately detects bubble defects without manual rule adjustments, improving inspection efficiency, consistency, and coating quality in electronics manufacturing.

AOI for Underfill Adhesive Inspection

This inspection system supports multiple adhesive types, including conformal coating, UF adhesive, RTV adhesive, and heat dissipation adhesives. It ensures precise defect detection and offers optional adhesive thickness measurement, helping manufacturers maintain high reliability and consistent bonding quality.

AOI for Underfill Coverage Inspection

 

Product Specification

 

Category

Specification (VF5100)

Specification (VF5300)

Image System

   

Camera

12MP Industrial Camera (Front), 5MP Industrial Camera (Side)

12MP Industrial Camera (Front), 5MP Industrial Camera (Side)

Resolution

10μm (Front), 11μm (Side before calibration)

10μm (Front), 11μm (Side before calibration)

FOV

4030mm (Front); 2420mm (Side)

4030mm (Front); 2420mm (Side)

Lens

Telecentric Lens (Front); Sham Lens (Side)

Telecentric Lens (Front); Sham Lens (Side)

Lighting

RGBW + Coaxial light + 4 side UV lights

RGBW + Coaxial light + 4 side UV lights

Movement Structure

   

X/Y Movement

AC Servo

AC Servo

Width Adjustment

Automatic

Automatic

Transport Type

Belt

Belt

Board Loading Direction

Left to Right or Right to Left (Select at point of order)

Left to Right or Right to Left (Select at point of order)

Fixed Rail

Front Rail

Front Rail

Operating System

Win 10

Win 10

Communication

Ethernet, SMEMA

Ethernet, SMEMA

Thickness/Height Sensor

Conformal Coating Thickness (Optional), Linear Laser (Optional)

Conformal Coating Thickness (Optional), Linear Laser (Optional)

Hardware Configuration

   

Power Requirement

Single Phase 220V, 50/60Hz, 5A

Single Phase 220V, 50/60Hz, 5A

Air Requirement

0.4–0.6MPa

0.4–0.6MPa

Conveyor Height

900±20mm

900±20mm

Equipment Dimensions

L1200D1640H1590mm (Without tower light)

L1200D1640H1590mm (Without tower light)

Equipment Weight

1400kg

1450kg

PCB Size

   

Size

5050–510510mm

5050–510510mm

PCB Weight

≤8kg

≤8kg

Thickness

0.6–6mm

0.6–6mm

Clearance

Top clearance 25–50mm adjustable, Bottom clearance 50mm

Top clearance 25–50mm adjustable, Bottom clearance 25–50mm adjustable

Clamping Edge

≥3.0mm

≥3.0mm

Inspection Functions

   

UV Adhesive

Missing adhesive, insufficient adhesive, excessive adhesive, adhesive area, adhesive length and width, bubbles, splashes, orange lines, pinholes, poor thickness (optional), etc.

Same as VF5100

Other Adhesive (UF, RTV, etc.)

Excessive adhesive, insufficient adhesive, splashing, air holes, poor side climbing adhesive, broken adhesive, adhesive area, adhesive length and width, adhesive height (optional), etc.

Same as VF5100

Components

Bump, Damage, Missing

Bump, Damage, Missing

Inspection Speed*

350–400ms/FOV

350–400ms/FOV

 

Product data is for reference only. Please contact us to confirm the latest information.

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