Machine Introduction

The latest Heller Reflow Oven MK7 reflow platform sets a new benchmark in modern SMT soldering technology.
Designed with a next-generation low-profile heating module, the system delivers outstanding thermal uniformity with significantly lower Delta-T across complex PCB assemblies-while dramatically reducing overall energy consumption.

A redesigned flux management architecture enhances collection efficiency, minimizes maintenance requirements, and keeps the process chamber exceptionally clean for long-term production stability.
The advanced cooling module achieves industry-leading cooling rates and ultra-low PCB exit temperatures, ensuring excellent thermal separation between zones and superior process control for both lead-free and high-density applications.

Products Description

Advanced Heating System for Superior Temperature Uniformity

Our upgraded low-profile heating module, combined with a high-efficiency impeller design, delivers exceptional thermal performance across the entire PCB.
The redesigned airflow architecture ensures smoother, more concentrated air distribution, resulting in significantly lower Delta-T and outstanding temperature uniformity-even on complex, high-density assemblies.

This next-generation heating system improves process stability, enhances solder quality, and supports consistent results across varying production demands.

Next-Generation Cooling System for High-Performance Reflow Soldering

Our advanced cooling platform offers multiple module configurations engineered to meet a wide range of production requirements-including the strict demands of modern lead-free soldering profiles.
Each cooling option is optimized to deliver precise thermal control, fast heat extraction, and exceptional process consistency.

For high-mass PCB assemblies or applications requiring extremely rapid cooling, an enhanced super-cooling system is available. This high-capacity module achieves cooling rates exceeding 6°C per second, while maintaining PCB exit temperatures below 50°C, ensuring stable downstream handling and superior solder joint reliability.

Stable Thermal Profiles & Low Delta-T with Optimized Energy Efficiency

The MK7 platform delivers outstanding thermal consistency through its enhanced heating architecture and advanced dynamic control system. These improvements ensure precise temperature distribution and exceptionally low Delta-T across the entire PCB surface.

Energy efficiency is significantly improved through upgraded sealing, reinforced insulation, and optimized airflow management.
Additionally, the integrated Energy Management System intelligently adjusts power usage during periods of reduced production load, enabling further reductions in operational energy consumption without compromising performance.

Optimized Design for Reduced Preventive Maintenance Time

The latest MK7 platform integrates a redesigned heat exchanger paired with a chilled-water flux management system, delivering exceptional flux separation efficiency while keeping routine maintenance simple and fast.
The upgraded water-box architecture enhances filtration performance, prevents buildup inside the process chamber, and ensures long-term production stability.

With its significantly increased capacity, the flux collection system extends maintenance intervals far beyond traditional designs-allowing operators to perform preventive maintenance less frequently and with dramatically reduced downtime.

Energy-Efficient Design for a Lower Carbon Footprint

Our reflow solutions are engineered with energy efficiency and environmental responsibility at their core.
By incorporating advanced heat management, optimized airflow structures, and intelligent power-saving technology, the system significantly reduces overall energy consumption and contributes to a lower carbon footprint.

Driven by a long-term commitment to green, sustainable development, we continuously integrate environmentally conscious design principles into our products.
While meeting the strict technical performance requirements of modern electronics manufacturing, our equipment helps factories move closer to global carbon-reduction and carbon-peaking targets.

Smart System Designed for Intelligent Manufacturing

Digital transformation continues to reshape every aspect of modern industry-and electronics manufacturing is no exception. To remain competitive, factories must evolve toward smart, connected, and data-driven production environments.

Our intelligent system architecture is designed to support this transition. By enabling real-time monitoring, data collection, and advanced analytics across production, process, and equipment, manufacturers can achieve the long-standing goals of faster delivery, lower operating cost, and higher product quality with greater efficiency than ever before.

With full compatibility for Industry 4.0, our software tools integrate seamlessly into smart factory ecosystems, empowering users with enhanced visibility, predictive capabilities, and optimized decision-making for truly intelligent manufacturing.

Configurable Designs Tailored to Your Application Needs

Today's electronics manufacturers require high productivity and steady performance, while equipment suppliers must deliver greater capability without sacrificing cost efficiency. To support growth and competitiveness, production lines need flexible systems that can easily adapt to diverse products and processes across both SMT and Semiconductor applications.

The MK7 platform is engineered with a highly configurable architecture that accommodates a broad range of board types, package sizes, and manufacturing requirements. This versatility enables you to expand into new markets, introduce new product lines, and respond quickly to changing customer demands-giving your business a clear competitive advantage.

Technical Specifications

Model	1505MK7	1707MK7	1809MK7	1810MK7	1826MK7	1913MK7	1936MK7	2043MK7 (3C)	2043MK7 (4C)
Length (mm) (Air/N2)	2200 / 2500	3600	4650	4650	4650	5900	5900	6774	7224
Width (mm)	1520	1520	1520	1520	1520	1520	1520	1520	1520
Height (mm)	1440	1440	1440	1440	1440	1440	1440	1440	1440
Weight (kg)	1510	1550	2060	2060	2060	2520	2420	3765	3765
Power Inputs	208/240/380/400/415/440/480 VAC	208/240/380/400/415/440/480 VAC	Same	Same	Same	Same	Same	Same	Same
Max Current Draw	100 Amp	130 Amp @ 208/240V	100 Amp @ 380–480V	100 Amp	100 Amp	100 Amp	100 Amp	100 Amp	100 Amp
Continuous Power (kW)	6	8 / 7	12 / 7.5	16 / 7.5	16 / 8	14 / 9	15 / 9	15 / 13	20 / 13
N2 Supply Pressure (bar)	5	5	5	5	5	5	5	5	5
N2 Operating Pressure (bar)	6	6	6	6	6	6	6	6	6
Typical N2 Consumption	500–700 SCFH	500–700 SCFH	Same	Same	Same	Same	Same	Same	Same
Heating Zones	5	7	9	10	8	13	10	13	13
Heating Length (mm) (Air/N2)	1340 / 1300	1920	2580	2830	2710	3570	3600	4390	4490
Cooling Zones	1	1	2	2	2	3	3	3	4
Cooling Length (mm) (Air/N2)	430 / 410	620	1000	750	870	1260	1230	1310	1660
Max Temperature (°C)	350	350	350	350	350	350	350	350	350
Temperature Controller Accuracy (°C)	±0.1	±0.1	±0.1	±0.1	±0.1	±0.1	±0.1	±0.1	±0.1
Profile Change Time (min)	5	15	15	15	15	15	15	15	15
PCB Support – Single Lane / Mesh Belt	50–560 mm (Option: 50–610 mm)	Same	Same	Same	Same	Same	Same	Same	Same
Dual Lane (Single Lane Mode)	50–400 mm (Option: 50–450 mm)	Same	Same	Same	Same	Same	Same	Same	Same
Dual Lane (Dual Lane Mode)	50–225 mm (Option: 50–250 mm)	Same	Same	Same	Same	Same	Same	Same	Same
Dual Lane Rails	FMMM, FMMF, FMFM	Same	Same	Same	Same	Same	Same	Same	Same

PCB Direction	Left to Right, Right to Left	Same	Same	Same	Same	Same	Same	Same	Same
PCB Top / Bottom Clearance	Mesh belt: +58 mm	Chain: +29 / +29 mm & +35 / +35 mm	Same for all
Transportation Height (mm)	Mesh belt: 930 ±60	Chain: 960 ±60 (Option 900 ±60)	Same
Conveyor Speed (mm/min)	250–1880	Same	Same	Same	Same	Same	Same	Same	Same
Length of PCB Support Pins	4.75 mm	4.75 mm	4.75 mm	4.75 mm	4.75 mm	4.75 mm	4.75 mm	4.75 mm	4.75 mm

Auto Lubrication System	Standard	Standard	Standard	Standard	Standard	Standard	Standard	Standard	Standard
Power Width Adjustment	Standard	Standard	Standard	Standard	Standard	Standard	Standard	Standard	Standard
KIC Profiling Software	Standard	Standard	Standard	Standard	Standard	Standard	Standard	Standard	Standard

Product data is for reference only. Please contact us to confirm the latest information.

Why Partner with Us

✓ More than just equipment supply - complete SMT line solutions
✓ Real project experience with installed and running SMT lines
✓ Strong engineering support for automation and integration
✓ Reduced integration risk and faster line start-up
✓ Dedicated technical support throughout the project lifecycle

About Us

We specialize in complete SMT line solutions and automation integration, delivering reliable equipment and proven production lines backed by real project experience.

Reflow Oven – FAQ

Q: 1. What is a reflow oven used for in SMT production?

A: A reflow oven is used in SMT production lines to solder electronic components onto PCB boards. After solder paste is printed and components are placed, the PCB passes through the reflow oven where controlled heating melts the solder paste, creating reliable solder joints.

Q: 2. How does a reflow oven work?

A: A reflow oven works by heating PCB assemblies through multiple temperature zones, including preheat, soak, reflow, and cooling zones. Each zone is precisely controlled to ensure stable soldering quality and minimize thermal stress on components.

Q: 3. How many heating zones does a reflow oven have?

A: Most SMT reflow ovens are available with 6 to 12 heating zones, depending on production requirements. More heating zones provide better temperature control and improved soldering quality, especially for complex or high-density PCB assemblies.

Q: 4. What types of reflow ovens are available?

A: Common types of reflow ovens include hot air reflow ovens, nitrogen reflow ovens, and lead-free reflow ovens. The selection depends on PCB complexity, solder paste type, and production quality requirements.

Q: 5. What is the difference between air and nitrogen reflow ovens?

A: A nitrogen reflow oven reduces oxygen levels during soldering, resulting in improved solder wetting, fewer defects, and better solder joint appearance. Hot air reflow ovens are more cost-effective and suitable for most standard SMT applications.

Q: 6. Is the reflow oven suitable for lead-free soldering?

A: Yes. Modern SMT reflow ovens are designed for lead-free soldering, offering precise temperature control and stable thermal performance to meet lead-free process requirements.

Q: 7. How do you set the temperature profile for a reflow oven?

A: The temperature profile is set based on solder paste specifications, PCB material, and component types. Proper profiling helps ensure consistent soldering quality and reduces defects such as tombstoning or cold joints.

Q: 8. Can the reflow oven be integrated into a complete SMT line?

A: Yes. A reflow oven can be fully integrated into a complete SMT production line, working seamlessly with solder paste printers, pick and place machines, AOI, and board handling equipment.

Q: 9. What maintenance is required for a reflow oven?

A: Regular maintenance includes cleaning flux residues, checking fans and heaters, inspecting conveyor systems, and verifying temperature accuracy to ensure stable long-term operation.

Q: 10. How do I choose the right reflow oven for my SMT line?

A: Choosing the right reflow oven depends on PCB size, production volume, soldering process, and line configuration. Working with an experienced SMT line solution provider helps ensure optimal performance and smooth line integration.

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