Machine Introduction
High-Performance SMT Lead-Free Reflow Oven for Precision PCB Assembly
Our SMT Reflow Oven is engineered to deliver stable, repeatable, and high-quality lead-free soldering for modern PCB assembly lines.
Built with an enhanced cooling system, high-durability stainless steel transport chain, and rapid warm-up technology, this reflow oven ensures exceptional performance in high-volume and high-mix SMT production environments.
The system's optimized thermal architecture guarantees precise temperature control, uniform heat distribution, and dependable reliability-making it suitable for consumer electronics, automotive electronics, industrial control, LED manufacturing, and EMS factories.
Key Features of the SMT Reflow Oven
Cooling Capacity Improvement
Enhanced cooling performance ensures faster temperature drop and better thermal protection:
- Cooling slope increased by 25%
- PCB outlet temperature reduced by 30%
This allows more controlled cooling, reduces thermal stress, and improves solder joint quality-especially crucial for high-power or temperature-sensitive components.
Stainless Steel Transport Chain
- Equipped with a double-row stainless steel transport chain
- Ensures stable PCB transfer throughout the reflow zones
- PCB edge welding temperature remains unaffected by guide rail heat absorption
- Guarantees consistent and reliable soldering results
This chain structure offers excellent durability, smooth motion, and long-term stability in continuous production.
Temperature Stability
- Built with 8mm thick thermal storage aluminum plates
- Provides superior heat retention and distribution
- Maintains stable temperatures during long-term mass production
This design ensures uniform thermal profiles across the entire reflow zone and supports consistent lead-free soldering quality.
Rapid Warming
Warm-up time is reduced by 30%, enabling rapid production startup
Independent control modules include:
- Transport speed control
- Cooling area fan control
- Preheating upper fan control
- Preheating lower fan control
This allows fast recipe switching, quick setup, and flexible temperature-profile adjustment.
Why This Reflow Oven Improves Your SMT Production
- More stable soldering for fine-pitch, BGA, CSP
- Faster warm-up → higher production efficiency
- Better cooling → improved joint reliability
- Enhanced chain structure → stable PCB transport
- Designed for 24/7 continuous operation
- Compatible with nitrogen reflow soldering (optional)
Applications
Ideal for high-precision, high-reliability PCB assembly:
Consumer electronics
Automotive electronics
LED modules
Industrial control systems
EMS & OEM manufacturing
High-density multi-layer PCBs
Technical Specifications Table
|
Parameter |
JTR-800 / JTR-800-N |
JTR-1000 / JTR-1000-N |
JTR-1200 / JTR-1200-N |
|
Heated Length |
3110mm |
3890mm |
4640mm |
|
Dimensions (L×W×H) |
5520×1430×1530mm |
6300×1430×1530mm |
7050×1430×1530mm |
|
Net Weight |
Approx. 2400KG / 2500KG |
Approx. 2700KG / 2800KG |
Approx. 3000KG / 3100KG |
|
Exhaust Volume |
10m³/min × 2 Exhausts |
10m³/min × 2 Exhausts |
10m³/min × 2 Exhausts |
|
Source Power |
AC 380V 3Ø 50/60Hz (AC 220V 3Ø optional) |
AC 380V 3Ø 50/60Hz (AC 220V 3Ø optional) |
AC 380V 3Ø 50/60Hz (AC 220V 3Ø optional) |
|
Power (Starting) |
30KW / 32KW |
36KW / 38KW |
40KW / 42KW |
|
Power (Operating) |
9KW / 10KW |
10KW / 11KW |
11KW / 12KW |
|
Heat Up Time |
Approx. 25min |
Approx. 25min |
Approx. 25min |
|
Temp. Range |
Room temperature – 300°C |
Room temperature – 300°C |
Room temperature – 300°C |
|
Max. Width of PCB |
400mm (Optional 460mm) |
400mm (Optional 460mm) |
400mm (Optional 460mm) |
|
Component Height |
Top 30mm / Bottom 25mm |
Top 30mm / Bottom 25mm |
Top 30mm / Bottom 25mm |
|
Conveyor Direction |
Left to Right (Optional Right to Left) |
Left to Right (Optional Right to Left) |
Left to Right (Optional Right to Left) |
|
Fixed Rail Side |
Front Rail Fixed (Optional Rear Rail Fixed) |
Front Rail Fixed (Optional Rear Rail Fixed) |
Front Rail Fixed (Optional Rear Rail Fixed) |
|
Conveyor Height |
900–1200mm |
900–1200mm |
900–1200mm |
|
Conveyor Speed |
300–2000mm/min |
300–2000mm/min |
300–2000mm/min |
|
Data Storage |
Various parameters & statuses storable |
Various parameters & statuses storable |
Various parameters & statuses storable |
|
Abnormal Alarm |
Over/Under Temp, Sound & Light |
Over/Under Temp, Sound & Light |
Over/Under Temp, Sound & Light |
|
Device Layout |
|
|
|
|
Heating Zones |
Top 8 / Bottom 8 |
Top 10 / Bottom 10 |
Top 12 / Bottom 12 |
|
Cooling Zones |
Top 3 / Bottom 3 |
Top 3 / Bottom 3 |
Top 3 / Bottom 3 |
|
Control System |
WIN10 + Industrial Computer + PLC |
WIN10 + Industrial Computer + PLC |
WIN10 + Industrial Computer + PLC |
|
Temp. Control |
PID + SSR |
PID + SSR |
PID + SSR |
|
Thermocouple Wire |
4+ wires |
4+ wires |
4+ wires |
|
Conveyor System |
Rail + Stainless Mesh |
Rail + Stainless Mesh |
Rail + Stainless Mesh |
|
Conveyor Control Mode |
Imported Inverter + Imported Conveyor Motor |
Imported Inverter + Imported Conveyor Motor |
Imported Inverter + Imported Conveyor Motor |
|
Chain Structure |
Double-link anti-block |
Double-link anti-block |
Double-link anti-block |
|
Width Adjustment |
Electric adjustable |
Electric adjustable |
Electric adjustable |
|
Cover Open Way |
Electric open |
Electric open |
Electric open |
|
UPS Power |
Backup power to finish production |
Backup power to finish production |
Backup power to finish production |
|
Cooling System |
Forced air cooling ("N" model) |
Forced air cooling ("N" model) |
Forced air cooling ("N" model) |
|
Extended Models |
JTR-800D / JTR-800L / JTR-800LD / JTR-800-N |
JTR-1000D / JTR-1000L / JTR-1000LD / JTR-1000-N |
JTR-1200D / JTR-1200L / JTR-1200LD / JTR-1200-N |
|
Extended Dimensions (L×W×H) |
5520×1660×1530mm |
6300×1660×1530mm |
7050×1660×1530mm |
|
Extended Net Weight |
Approx. 2750KG / 2850KG |
Approx. 3050KG / 3150KG |
Approx. 3350KG / 3450KG |
|
Extended Heat Up Time |
Approx. 30min |
Approx. 30min |
Approx. 30min |
|
Rail Width Range |
"D" Model: 50–270mm |
"L" Model: 50–610mm |
"DL" Model: 50–270mm / "N" Model: 50–610mm |
|
Nitrogen Model |
N–Nitrogen |
N–Nitrogen |
N–Nitrogen |
|
Nitrogen Consumption |
Standard 300–1000PPM at 20M³/hr / "D", "L", "DL" Models: 500–1000PPM at 25–30M³/hr |
Standard 300–1000PPM at 20M³/hr / "D", "L", "DL" Models: 500–1000PPM at 25–30M³/hr |
Standard 300–1000PPM at 20M³/hr / "D", "L", "DL" Models: 500–1000PPM at 25–30M³/hr |
Product data is for reference only. Please contact us to confirm the latest information.
Why Partner with Us
✓ More than just equipment supply - complete SMT line solutions
✓ Real project experience with installed and running SMT lines
✓ Strong engineering support for automation and integration
✓ Reduced integration risk and faster line start-up
✓ Dedicated technical support throughout the project lifecycle
About Us
We specialize in complete SMT line solutions and automation integration, delivering reliable equipment and proven production lines backed by real project experience.
Reflow Oven – FAQ
Q: 1. What is a reflow oven used for in SMT production?
A: A reflow oven is used in SMT production lines to solder electronic components onto PCB boards. After solder paste is printed and components are placed, the PCB passes through the reflow oven where controlled heating melts the solder paste, creating reliable solder joints.
Q: 2. How does a reflow oven work?
A: A reflow oven works by heating PCB assemblies through multiple temperature zones, including preheat, soak, reflow, and cooling zones. Each zone is precisely controlled to ensure stable soldering quality and minimize thermal stress on components.
Q: 3. How many heating zones does a reflow oven have?
A: Most SMT reflow ovens are available with 6 to 12 heating zones, depending on production requirements. More heating zones provide better temperature control and improved soldering quality, especially for complex or high-density PCB assemblies.
Q: 4. What types of reflow ovens are available?
A: Common types of reflow ovens include hot air reflow ovens, nitrogen reflow ovens, and lead-free reflow ovens. The selection depends on PCB complexity, solder paste type, and production quality requirements.
Q: 5. What is the difference between air and nitrogen reflow ovens?
A: A nitrogen reflow oven reduces oxygen levels during soldering, resulting in improved solder wetting, fewer defects, and better solder joint appearance. Hot air reflow ovens are more cost-effective and suitable for most standard SMT applications.
Q: 6. Is the reflow oven suitable for lead-free soldering?
A: Yes. Modern SMT reflow ovens are designed for lead-free soldering, offering precise temperature control and stable thermal performance to meet lead-free process requirements.
Q: 7. How do you set the temperature profile for a reflow oven?
A: The temperature profile is set based on solder paste specifications, PCB material, and component types. Proper profiling helps ensure consistent soldering quality and reduces defects such as tombstoning or cold joints.
Q: 8. Can the reflow oven be integrated into a complete SMT line?
A: Yes. A reflow oven can be fully integrated into a complete SMT production line, working seamlessly with solder paste printers, pick and place machines, AOI, and board handling equipment.
Q: 9. What maintenance is required for a reflow oven?
A: Regular maintenance includes cleaning flux residues, checking fans and heaters, inspecting conveyor systems, and verifying temperature accuracy to ensure stable long-term operation.
Q: 10. How do I choose the right reflow oven for my SMT line?
A: Choosing the right reflow oven depends on PCB size, production volume, soldering process, and line configuration. Working with an experienced SMT line solution provider helps ensure optimal performance and smooth line integration.
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