Nitrogen Reflow Soldering Oven

This advanced Nitrogen Reflow Soldering Oven is designed to meet the demands of modern high-density and lead-free SMT production.
By integrating precise thermal control, efficient nitrogen management, intelligent flux recovery, and a stable transportation system, the machine delivers consistent soldering quality, high throughput, and long-term process stability.

Engineered for both high-mix and high-volume manufacturing, the system ensures reliable performance on complex PCB assemblies, including fine-pitch components, BGA, CSP, and high thermal mass boards.
Its modular design, low operating cost, and intelligent control architecture make it an ideal solution for manufacturers focused on quality, efficiency, and reliability.

Precise Nitrogen Control Across The Entire Process

Our advanced nitrogen system provides independent closed-loop oxygen monitoring for each temperature zone, ensuring stable low-oxygen conditions throughout the whole reflow process.

 

Oxygen concentration can be precisely controlled within 50–200 ppm

Independent control for each heating zone guarantees consistent and repeatable soldering results

 

Optimized nitrogen usage reduces operating costs while maintaining process stability

Why Low-Oxygen Control Matters

Maintaining a low-oxygen environment is critical for modern SMT production, especially for lead-free soldering, fine-pitch components, and miniaturized assemblies.

• Prevents secondary oxidation of solder joints, improving wetting and joint reliability
• Expands the lead-free soldering process window, making process setup and tuning easier
• Reduces solder surface tension in a nitrogen atmosphere, allowing lower peak temperatures and shorter reflow time

Intelligent Flux Recovery System

To further enhance process stability and cleanliness, the system integrates an intelligent flux recovery solution.

 

Staged Flux Recovery Design

By leveraging the physical characteristics of flux volatilization, volatile organic compounds are captured and recovered in stages, reducing contamination inside the oven

Bottom Exhaust Recovery Design

The specially designed bottom exhaust recovery structure prevents flux accumulation at the exhaust ports, eliminating flux dripping issues during production.

High-Efficiency Preheating Module

Designed to deliver stable and uniform heating, even when processing boards with large component size differences.

• Maintains high thermal efficiency at low convection airflow
• Minimizes temperature shadowing on mixed-technology PCB assemblies
• Ensures smooth and reliable heat transfer from preheating to reflow

High Throughput, Low Energy Consumption

The system is engineered for high productivity without sacrificing energy efficiency.

• Production speed up to 160 cm/min
• Optimized thermal management system reduces overall power consumption
• Ideal for high-speed, high-precision PCB assembly lines

Excellent Temperature Control Accuracy

Precision temperature control is critical for consistent soldering quality.

• Temperature deviation between set value and actual value within ±1.0°C
• Temperature fluctuation between no-load and full-load conditions within 1.5°C
• Temperature difference between adjacent zones within 100°C, supported by fast heating and cooling response

Fast Thermal Recovery Capability

The advanced PID control system combined with a high heat-capacity furnace structure provides rapid thermal compensation, even under changing load conditions.

• Fast temperature recovery during continuous production
• Stable thermal performance under full-load and no-load conditions
• Furnace temperature fluctuation within ±1.5°C

Multi-Zone Double-Sided Cooling Design
The advanced cooling module ensures fast, controlled, and uniform cooling after reflow.

• Multi-zone, double-sided cooling structure
• Designed for PCB assemblies with high thermal mass
• Ensures low and stable product outlet temperature

Superior Cooling Compared To Traditional Designs

Compared to conventional single-sided cooling, this system achieves significantly faster cooling rates:

• Faster temperature drop from 200°C to 150°C
• Shorter cooling time from 200°C to 100°C
• Improved profile consistency across the entire PCB

KTS Series

KTD Series

KTS-L Series

Product data is for reference only. Please contact us to confirm the latest information.

  More than just equipment supply - complete SMT line solutions
Real project experience with installed and running SMT lines
Strong engineering support for automation and integration
Reduced integration risk and faster line start-up
Dedicated technical support throughout the project lifecycle

We specialize in complete SMT line solutions and automation integration, delivering reliable equipment and proven production lines backed by real project experience.

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